Broken Seal Ring Structures for Moisture Protection
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Solution Overview
Problem
Seal rings in semiconductor chips face challenges in preventing moisture penetration due to their design, which can lead to reliability degradation and noise coupling, especially when customized applications require enhanced protection.
Innovation Solution
The introduction of broken seal rings with openings and additional moisture barriers formed in the metallization layers, which extend and narrow the moisture-traveling paths, and the use of sacrificial seal rings to misalign and further extend these paths, thereby reducing moisture penetration and noise coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a continuous seal ring is formed to block moisture penetration, then moisture protection is improved, but noise coupling between circuits increases
Solution Approach 1:
The seal ring is segmented by introducing openings that break the continuous conductive path into isolated sections. This segmentation maintains the moisture-blocking function while eliminating the noise coupling pathway, as the conductive segments are electrically isolated from each other by the openings.
2Object-generated harmful factors
If openings are introduced in the seal ring to reduce noise coupling, then noise protection is improved, but moisture penetration paths are created
Solution Approach 1:
Moisture barrier structures are introduced as intermediary elements that fill or line the openings in the seal ring. These barriers prevent moisture from penetrating through the openings while allowing the openings to maintain their noise-isolation function. The moisture barrier acts as a mediator that addresses both the noise coupling and moisture protection requirements.
3Adaptability or versatility
If customized seal ring designs are implemented for specific applications, then adaptability is improved, but device complexity increases
Solution Approach 1:
The seal ring is divided into modular segments separated by openings, allowing each segment to be independently configured for specific application requirements. This segmentation enables customization of the seal ring's electrical and physical characteristics without requiring complete redesign, thereby reducing complexity while maintaining adaptability.
Solution Approach 2:
Different regions of the seal ring can have different properties (e.g., varying opening sizes, barrier material compositions, or segment configurations) tailored to local requirements. This allows customized protection for specific circuits or areas while keeping other regions standardized, balancing adaptability with manufacturing simplicity.
Data Source
AI summary
A semiconductor chip includes a seal ring adjacent to edges of the semiconductor chip; an opening extending from a top surface to a bottom surface of the seal ring, wherein the opening has a first end on an outer side of the seal ring and a second end on an inner side of the seal ring; and a moisture barrier having a sidewall parallel to a nearest side of the seal ring, wherein the moisture barrier is adjacent the seal ring and has a portion facing the opening.