Broken Wafer Suction Head for In-Line Debris Removal
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Solution Overview
Problem
Existing substrate processing systems face disruptions and increased costs due to broken wafers, which cause contamination and require manual cleaning, leading to reduced manufacturing throughput, especially in solar cell fabrication.
Innovation Solution
A system and method for detecting and removing broken substrates using a suction head with a placing mechanism, optical sensors, and a suction pump, allowing for automated removal without system disassembly or manual labor, utilizing a suction head with extendable pins for breaking wafers into smaller pieces and a hood with airflow to prevent thermal conductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual cleaning is performed after wafer breakage, then contamination is removed, but system throughput is reduced and manual labor is required
Solution Approach 1:
The system performs automatic detection and removal of broken wafers using optical sensors and a suction head with breaking pins, eliminating the need for manual intervention. The controller autonomously coordinates the placement mechanism to position the suction head over broken wafers and activates the suction pump to remove debris, allowing the system to maintain itself without stopping production or requiring manual labor.
Solution Approach 2:
The patent replaces manual mechanical cleaning with an automated pneumatic system. The suction head uses a suction pump to create negative pressure that draws broken wafer pieces through a hose and filter, substituting human hands and cleaning tools with a mechanical-pneumatic automation system that operates continuously without interrupting throughput.
2Reliability
If the system is stopped for manual cleaning, then broken wafers are removed, but production disruption increases
Solution Approach 1:
The automated suction system operates continuously during wafer processing without requiring system shutdowns. The optical sensors continuously monitor for broken wafers, and when detected, the placement mechanism and suction pump immediately activate to remove debris, allowing production to proceed uninterrupted while maintaining cleanliness.
Solution Approach 2:
The system autonomously detects and removes broken wafers without external intervention, maintaining continuous operation. The controller monitors sensor inputs and automatically activates the suction mechanism, enabling the system to service itself during production without stopping the manufacturing process.
3Measurement precision
If optical sensors are used to detect broken wafers, then detection precision is improved, but device complexity increases
Solution Approach 1:
The optical sensor system serves multiple functions: detecting broken wafers, monitoring wafer positions, and providing feedback to the controller for coordination with the placement mechanism and suction pump. This multi-functional use of optical detection reduces the need for separate specialized sensors, balancing detection precision with system complexity.
Solution Approach 2:
The controller acts as an intermediary that processes signals from the optical sensors and coordinates the placement mechanism and suction pump. This centralized control simplifies the overall system architecture by consolidating the complexity of coordinating multiple components into a single control unit that responds to sensor inputs with pre-programmed actions.
4Reliability
If suction head is positioned over broken wafer, then removal effectiveness is improved, but risk of spreading particles increases
Solution Approach 1:
The suction head incorporates breaking pins that divide broken wafer pieces into smaller segments. This segmentation prevents large irregular pieces from being scattered during removal and allows the suction force to effectively draw all debris particles through the hose and filter, improving removal effectiveness while containing particles within the controlled suction path.
Solution Approach 2:
The hose and filter system act as intermediaries between the suction head and the external environment. The hose channels all suctioned particles directly to the filter, preventing particles from escaping into the chamber during the suction process. The filter then captures and contains the particles, eliminating the risk of contamination spread while maintaining effective removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables continuous operation by automatically detecting and removing broken wafers, reducing contamination and manual labor, thereby maintaining system throughput and minimizing production disruptions.
Implementation Method 1
a suction pump; and a flexible hose coupling the suction head to the suction pump
Implementation Method 2
A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood
Data Source
AI summary
An apparatus and method for recovery and cleaning of broken substrates, for fabrication systems using silicon wafers. A placing mechanism moves a suction head to a location of the broken substrate and a suction pump coupled to a flexible hose is used to remove the broken pieces. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. Pins are extendable about the inlet of the suction head to enable breakage of the substrate to smaller pieces for removal.