Brush Box Cleaning Module for Die-Stack Hybrid Bonding
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Solution Overview
Problem
Current cleaning methods for die-stack bonding, such as wet cleaning, are ineffective in removing stubborn residues and particles from die surfaces without causing side effects like watermarks, scratches, or surface roughness, and may not be compatible with all substrate materials.
Innovation Solution
A hybrid bonding platform incorporating a brush box cleaning module that uses a combination of mechanical brushes and cleaning agents to effectively remove residues and particles from die surfaces, integrated with other cleaning methods like wet cleaning and plasma treatment, to ensure thorough surface preparation for bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wet cleaning methods are used to clean die surfaces, then cleaning capability is improved, but side effects such as watermarks, scratches, and surface roughness occur
Solution Approach 1:
The patent replaces traditional wet cleaning methods with a mechanical brush-based cleaning system. The brush box assembly uses rotating brushes with controlled contact pressure to mechanically remove contaminants from die surfaces without using liquid chemicals, thereby eliminating watermarks and chemical-induced surface damage while maintaining effective cleaning capability.
Solution Approach 2:
The patent introduces a brush box assembly as an intermediary cleaning mechanism between the die surface and contaminants. The brushes act as a mediator that physically contacts and removes particles and residues through controlled mechanical action, providing a safe intermediate step that prevents direct harmful effects of wet cleaning methods.
2Object-affected harmful factors
If alternative cleaning methods such as plasma cleaning or laser cleaning are used, then surface damage is reduced, but effectiveness in removing stubborn residues and particles is limited
Solution Approach 1:
The patent employs parameter changes by adjusting brush material composition, brush hardness, rotational speed, and contact pressure to optimize cleaning effectiveness. By varying these parameters, the system can effectively remove stubborn residues and particles from die surfaces while maintaining control over the mechanical action to prevent surface damage, overcoming the limitations of fixed-parameter plasma or laser methods.
3Reliability
If integrated hybrid bonding platform with brush box cleaning module is implemented, then bonding yield and reliability are improved, but device complexity increases
Solution Approach 1:
The patent merges the cleaning function and bonding function into an integrated hybrid bonding platform. The brush box cleaning module is combined with the bonding apparatus in a single system, allowing cleaning and bonding operations to be performed sequentially without requiring separate standalone cleaning equipment, thereby reducing overall system complexity while improving bonding yield through consistent cleaning quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The brush box cleaning module enhances bonding yield and reliability by removing contaminants without causing damage, making it adaptable for various bonding applications, including die-to-wafer and wafer-to-wafer bonding.
Implementation Method 1
a plurality of brushes configured to engage with a surface of the substrate
Implementation Method 2
cleaning a surface of the substrate by removing residues and particles
Implementation Method 3
cleaning agent delivery system configured to deliver a cleaning agent to the plurality of brushes
Data Source
AI summary
A brush box cleaning module is introduced as part of the pre-treatment process flow in an integrated hybrid bonding platform. It addresses the technical problem of achieving high cleanliness levels on die front-side and back-side surfaces, particularly by removing residues and particles induced by backgrinding tape and dicing tape. The brush box cleaning module efficiently removes stubborn residues and particles both chemically and mechanically, resulting in a clean and passivated surface without causing watermarks, scratches, corrosion, or surface roughness. This disclosed approach enhances the bonding yield and provides significant advantages over existing methods in die-stack hybrid bonding applications.