Brush-Liquid Substrate Cleaning for Strongly Adhered Contaminants
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Solution Overview
Problem
Existing methods for removing foreign substances from substrates, such as chemical or deionized water, are inadequate for substances adhered strongly to the substrate surface, which can hinder effective bonding in semiconductor package production.
Innovation Solution
A substrate cleaning apparatus utilizing a brush and cleaning liquid to remove foreign substances, combined with a rotating and moving foreign substance remover, effectively cleans both surfaces of the substrate before bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chemical or deionized water is used for cleaning, then the cleaning process is simple and gentle, but foreign substances strongly adhered to the substrate cannot be effectively removed
Solution Approach 1:
The cleaning apparatus is divided into multiple independent modules: a cleaning liquid supply unit, a brush unit with rotating brush, and a drying unit. Each module performs a specific function, allowing the system to tackle strongly adhered foreign substances through mechanical action while maintaining operational simplicity and modularity.
Solution Approach 2:
The brush unit is designed to rotate, transforming a static cleaning structure into a dynamic one. The rotation enables the brush to mechanically remove strongly adhered foreign substances that cannot be removed by static chemical or water-based cleaning methods alone.
2Reliability
If a brush is introduced to remove strongly adhered foreign substances, then cleaning effectiveness improves, but the risk of substrate damage increases
Solution Approach 1:
Cleaning liquid is introduced as an intermediary substance between the brush and the substrate. The liquid reduces friction and prevents direct mechanical contact between the brush and substrate surface, enabling effective foreign substance removal while protecting the substrate from damage.
Solution Approach 2:
The cleaning liquid changes the friction parameters at the brush-substrate interface. By introducing liquid with specific viscosity and lubricating properties, the system achieves sufficient cleaning force to remove adhered substances while maintaining low enough friction to prevent substrate damage.
3Productivity
If only chemical cleaning is used, then the process is simple, but productivity is reduced due to inability to handle strongly adhered contaminants
Solution Approach 1:
The apparatus merges chemical cleaning (cleaning liquid supply) with mechanical cleaning (rotating brush) into a single integrated system. This combination enables the removal of strongly adhered foreign substances that would be impossible to remove with chemical cleaning alone, significantly improving productivity for contaminated substrates.
Solution Approach 2:
The cleaning apparatus is designed with multi-functionality, capable of handling both weakly and strongly adhered foreign substances through the combination of chemical and mechanical cleaning methods. This universal approach eliminates the need for separate cleaning processes, improving overall productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus efficiently removes stubborn foreign substances, ensuring clean surfaces for optimal substrate bonding, thereby enhancing the quality and reliability of semiconductor packages.
Implementation Method 1
a foreign substance remover configured to remove a foreign substance from a second surface by contacting the second surface, wherein the foreign substance remover is further configured to rotate while being in contact with the second surface
Implementation Method 2
remove, using a cleaning liquid and a brush, a foreign substance adhered to the first substrate and the second substrate
Data Source
AI summary
A substrate cleaning apparatus may be provided and include: a first process chamber configured to plasma-treat a first substrate and a second substrate; a substrate cleaning apparatus configured to clean the first substrate and the second substrate; and a second process chamber configured to bond the first substrate and the second substrate to each other, wherein the substrate cleaning apparatus is further configured to remove, using a cleaning liquid and a brush, a foreign substance adhered to the first substrate and the second substrate, and wherein the second process chamber is further configured to bond the first substrate and the second substrate to each other after the first substrate and the second substrate are cleaned by the substrate cleaning apparatus.