Brushless Motor PCB Thermal Layout for Compact Heat Dissipation
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Solution Overview
Problem
Conventional brushless DC motors face challenges in heat dissipation, leading to increased volume due to stacked heat sinks and power switching elements, which hinders the reduction of overall motor size.
Innovation Solution
A brushless motor assembly design featuring a circuit board with thermoconductive layouts on its surface, where power switching elements and heat sinks are juxtaposed, allowing for efficient thermal energy transfer and dissipation without increasing the motor's thickness, thereby reducing the overall volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks are stacked on the switching element to achieve heat dissipation, then heat dissipation effect is improved, but total thickness increases resulting in larger overall volume
Solution Approach 1:
The patent transitions from a vertical stacking arrangement (one dimension) to a planar side-by-side arrangement on the circuit board surface (two dimensions). The heat sink and switching element are positioned adjacent to each other on the same plane of the circuit board, utilizing the board's surface area rather than stacking in the thickness direction. This dimensional change effectively reduces the motor's overall volume while maintaining adequate heat dissipation capability.
2Temperature
If power switching elements are stacked with heat sinks, then heat dissipation is achieved, but device complexity increases due to increased assembly layers
Solution Approach 1:
The patent merges the heat dissipation function with the existing circuit board structure. The heat sink is integrated into the circuit board assembly alongside the switching element, sharing the same mounting surface and thermal pathways. This consolidation eliminates the need for separate stacked assemblies, reducing the number of assembly layers and simplifying the overall device structure while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the motor's volume by improving heat dissipation while maintaining efficient thermal management, specifically by arranging power switching elements and heat sinks on the circuit board's surface, allowing for better thermal energy transfer and dissipation without adding thickness.
Implementation Method 1
Each of the power switching elements and each of the heat sinks are connected to one of the thermoconductive layouts, so that a thermal energy generated by each of the power switching elements is transferred to each of the heat sinks through each of the thermoconductive layouts
Data Source
AI summary
A brushless motor assembly includes a motor body, a circuit board, and a plurality of electronic elements. The circuit board is disposed on the motor body and has a first surface and a second surface which face opposite directions. The first surface faces the motor body. The second surface has a plurality of thermoconductive layouts. The electronic elements include a plurality of power switching elements disposed on the second surface. A plurality of heat sinks is disposed on the second surface. Each of the power switching elements and each of the heat sinks are connected to each of the thermoconductive layouts, so that a thermal energy generated by each of the power switching elements is transferred to each of the heat sinks through each of the thermoconductive layouts. This configuration thereby reduces an overall volume of the brushless motor assembly.