Vehicle Blind Spot Detection Backlight Resin Molding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional blind spot detection (BSD) module manufacturing for vehicles is inefficient due to repeated processes of fusing and epoxying, which reduces productivity, increases drying time, and necessitates additional space and time for epoxy drying, especially during mass production.
Innovation Solution
A backlight apparatus for vehicles is developed using a single resin molding process that integrates the lens and case, eliminating the need for fusing and epoxying, and includes a light guide plate, reflective plate, and sealing with molding resin to provide waterproof and sealing functions, reducing manufacturing time and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional fusing and epoxying processes are used to waterproof and seal the BSD module, then waterproofing and sealing functions are achieved, but productivity is reduced and manufacturing time is increased
Solution Approach 1:
The patent merges the lens and case into a single integrated component formed by one-step resin molding. This eliminates the need for separate fusing and epoxying processes, achieving waterproofing and sealing inherently through the integrated structure while significantly improving productivity by reducing the number of manufacturing steps
Solution Approach 2:
The resin molding process serves multiple functions simultaneously: it forms the appearance of the product, provides structural integrity, and ensures complete waterproofing and sealing. This multi-functionality eliminates the need for separate waterproofing processes like epoxying
2Reliability
If conventional fusing and epoxying processes are used, then waterproofing is achieved, but manufacturing time is increased due to drying time
Solution Approach 1:
The molding process combines appearance formation and waterproofing into a single operation. The resin is molded into the final shape while simultaneously creating the waterproof seal, eliminating the separate drying time required for epoxy applications
Solution Approach 2:
The patent skips the time-consuming drying step entirely by using resin molding instead of epoxy application. The molding process completes both shaping and sealing in one rapid operation without requiring subsequent drying time
3Reliability
If conventional epoxying process is used for sealing, then sealing function is provided, but drying space and unnecessary factors are increased during mass production
Solution Approach 1:
The patent merges the sealing function into the primary molding process itself. The resin is molded to form both the product appearance and the sealing structure simultaneously, eliminating the need for separate epoxy application and drying space
Solution Approach 2:
The patent extracts the sealing function from the separate epoxying process and integrates it into the molding process. This eliminates the unnecessary drying space and process complexity associated with conventional epoxy application
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of manufacturing processes and parts, lowers development costs, and enables faster production with improved waterproofing and sealing, while maintaining consistent product quality and weight.
Implementation Method 1
supplying a molding resin to the opening with the circuit part seated therein, and to the at least one hole, to seal the opening and the at least one hole
Implementation Method 2
a light guide plate mounted on an inner upper portion of the case through the opening to diffuse the light emitted from the light source and deliver the light to the lens
Implementation Method 3
a reflective plate disposed behind the light guide plate through the opening to reflect light leaking to the back of the light guide plate
Data Source
AI summary
A backlight apparatus for vehicle and a manufacturing method thereof are provided, in which the backlight apparatus for vehicle includes a case having an opening formed at a lower portion, a lens provided on a front side of the case, a circuit part seated on an inner lower portion of the case through the opening, and mounted with a light source for emitting light; a light guide plate mounted on an inner upper portion of the case through the opening to diffuse the light emitted from the light source and deliver the light to the lens, a reflective plate disposed behind the light guide plate through the opening to reflect light leaking to the back of the light guide plate, and a sealing part for sealing the opening with the circuit part seated therein. A molded blind spot detection (BSD) that integrates therein lens and case is formed by a single molding process instead of repeated process of fusing and epoxying that are necessary in the related art, by use of resin molding, which not only forms an appearance of a product, but also provides a complete waterproof and sealing function.


