Backside Illuminated Image Sensor Crosstalk Reduction

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Solution Overview

Problem

MOS image sensors face sensitivity degradation due to light reflection and absorption by metallic wire layers, leading to crosstalk between pixels, which is not effectively addressed by existing technologies.

Innovation Solution

The design and fabrication of an image sensor with a substrate having a pixel region and a non-pixel region, featuring a base well with higher doping concentration than the first wells, allowing for stable well-bias sharing among first wells through the base well, thereby maintaining electric potential and reducing crosstalk.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If metallic wire layers are used for interconnects, then device complexity is reduced and manufacturing is simplified, but light reflection and absorption occur causing sensitivity degradation and crosstalk

Engineering Contradiction:
Improveinterconnect structureVSAvoidsensitivity
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent removes metallic wire layers from the front side of the substrate where light is incident. Instead, interconnect structures are formed only on the back side of the substrate, extracting the harmful metallic layers from the light path while maintaining electrical connectivity functions through alternative routing

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent inverts the conventional interconnect structure arrangement by placing all metallic interconnect layers on the back side of the substrate rather than the front side. This inversion allows light to incident on the front side without encountering metallic reflections or absorptions, while electrical connections are established through the inverted interconnect architecture

Inventive Principle:
Principle #13The other way round (Inversion)

2Manufacturing precision

If back side illuminated structure is used to eliminate metallic wire layer interference, then sensitivity is improved, but electric potential of wells becomes unstable causing crosstalk

Engineering Contradiction:
ImprovesensitivityVSAvoidelectric potential stability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent introduces a base well as an intermediary structure between the first wells and the back side of the substrate. This base well acts as a mediator that provides a stable reference potential, enabling the first wells to share a common well-bias through the base well, thereby stabilizing electric potentials while maintaining the back side illuminated structure

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent modifies the doping concentration parameter by creating a base well with higher doping concentration than the first wells. This parameter change in doping concentration enables the base well to function as an effective potential reference, stabilizing the electric potentials of the first wells through the doping concentration difference

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration stabilizes the electric potential of the wells, enhancing sensitivity and reducing crosstalk between pixels, improving the overall performance of the image sensor.

Implementation Method 1

a base well in the non-pixel region and between the at least one first well and a second side of the substrate

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

a base well in the non-pixel region and having a higher doping concentration than a doping concentration of the plurality of first wells

Methodology Applied
Scientific EffectDoping: Dopants

Data Source

PatentUS8576318B2Image sensors and methods of fabricating the same
Publication Date: 2013.11.05 SAMSUNG ELECTRONICS CO LTD
  • US8576318B2 patent drawing
  • US8576318B2 patent drawing
  • US8576318B2 patent drawing

AI summary

An image sensor and a method of fabricating the same are provided. The image sensor includes a substrate having a pixel region including a plurality of unit pixels and a non-pixel region, at least one first well in the non-pixel region, an interconnect structure on a first side of the substrate, and a base well in the non-pixel region and between the first well and a second side of the substrate.