Back-Side Illuminated Sensor Direct Bonding Logic
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Solution Overview
Problem
Existing solid-state image capturing devices face challenges in achieving a small form factor while maintaining cost-effectiveness, particularly in back-side illuminated configurations where the integration of peripheral circuits with the sensor semiconductor element is complex due to the need for support substrates and precise via formation.
Innovation Solution
A back-side illuminated solid-state image capturing device design that incorporates a combination of penetration vias and land electrodes with distinct pitch diameters, along with a rewiring configuration, to enhance area efficiency and reduce the size of the sensor semiconductor element, allowing for simpler manufacturing and integration of logic semiconductor elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a back-side illuminated sensor semiconductor element is used with peripheral circuit integration, then photoelectric conversion efficiency is improved, but device complexity and manufacturing difficulty increase due to support substrate requirements
Solution Approach 1:
The patent extracts the support substrate from the integration structure, allowing the sensor semiconductor element to be mounted directly on the logic semiconductor element. This eliminates the intermediate support substrate layer while maintaining mechanical strength through direct bonding, thereby reducing device complexity without compromising photoelectric conversion efficiency
Solution Approach 2:
Instead of mounting the sensor semiconductor element on a support substrate and then integrating the logic circuit, the patent inverts the structure by directly mounting the sensor element on the logic semiconductor element. This inversion simplifies the overall device architecture and reduces manufacturing steps
2Manufacturing precision
If penetration vias with small pitch are formed in support substrate, then connection precision is improved, but manufacturing difficulty increases
Solution Approach 1:
The patent removes the support substrate from the structure, eliminating the need to form penetration vias through it. The connection is established directly between the sensor semiconductor element and logic semiconductor element through bonding pads, thereby achieving precise connections without the manufacturing complexity of small-pitch via formation in thick substrates
3Area of stationary object
If sensor semiconductor element size is reduced for smaller device, then area efficiency is improved, but structural strength decreases
Solution Approach 1:
The patent merges the sensor semiconductor element directly with the logic semiconductor element through direct bonding, creating a unified structure. This integration provides mechanical support through the combined structure, allowing the sensor element to be miniaturized without compromising overall structural strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of a smaller solid-state image capturing device with improved area efficiency, facilitating the integration of logic semiconductor elements while maintaining the necessary strength and reducing manufacturing complexity.
Implementation Method 1
a photoelectric conversion element that photoelectrically converts incident light
Data Source
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AI summary
There is provided an imaging device including: a first semiconductor substrate (21) having a first region (22, R11) that includes a photoelectric conversion section (67) and a via portion (51), a second region (R12) adjacent to the first region, a connection portion (53, 84, 85) disposed at the second region, and a second semiconductor substrate (81), wherein the connection portion electrically couples the first semiconductor substrate to the second semiconductor substrate in a stacked configuration, and wherein a width of the connection portion is greater than a width of the via portion.