Bubble-Assisted Die Transfer for Precise LED Die Placement
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Solution Overview
Problem
The transfer and placement of semiconductor dies, particularly LED dies, in laser-assisted applications face complexities such as accurate placement and alignment issues during the transition from a carrier to a receive substrate.
Innovation Solution
A method and system utilizing a transfer material that forms a bubble upon exposure to light energy, allowing the die to be transferred from a carrier to a receive substrate while in contact with the bubble, and a transfer material with a reactive portion and die contact portion to support and form a bubble for die transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser assisted transfer is used to transfer LED die from carrier to receive substrate, then transfer speed and productivity can be improved, but accurate placement and alignment become more difficult to control
Solution Approach 1:
A transfer material is introduced as an intermediary between the die and carrier. This transfer material includes a reactive portion that forms a bubble when exposed to light energy, and a die contact portion that interfaces with the die. The bubble acts as a mediator to transfer the die from the carrier to the receive substrate, enabling both rapid transfer and precise placement control.
Solution Approach 2:
The transfer material undergoes a parameter change when the reactive portion is exposed to light energy, transforming from a non-reactive state to forming a bubble. This parameter change (formation of bubble) enables controlled transfer of the die, allowing the system to achieve both high speed and high precision by controlling when and where the bubble forms.
2Device complexity
If traditional transfer methods are used without bubble formation, then alignment control is simpler, but adhesion and controlled movement during transfer are insufficient
Solution Approach 1:
The transfer material with die contact portion serves as an intermediary that provides both adhesion and controlled movement. The die contact portion adheres to the die, while the reactive portion forms a bubble that enables controlled transfer, thus improving reliability without significantly increasing alignment complexity.
Solution Approach 2:
The reactive portion of the transfer material undergoes a phase transition or chemical change when exposed to light energy, forming a bubble. This phase transition enables the transfer material to change from a static adhesive state to an active transfer state, providing both strong adhesion and controlled movement during the transfer process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances control over die placement and alignment, reducing misalignment, poor adhesion, and uncontrolled movement during transfer, providing precise and controlled application of pressure on the receive substrate.
Implementation Method 1
exposing the transfer material to light energy to form a bubble in the transfer material
Data Source
AI summary
A method of transferring a die from a carrier to a receive substrate is provided. The method includes the steps of: (a) supporting a die on a carrier, a transfer material being provided between the die and the carrier; (b) exposing the transfer material to light energy to form a bubble in the transfer material; and (c) transferring the die from the carrier to a receive substrate using the bubble, the die being in contact with the bubble when the die contacts the receive substrate.