Bubble-Assisted Die Transfer for Precise Substrate Placement
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Solution Overview
Problem
The transfer and placement of semiconductor dies, particularly LED dies, in laser-assisted applications face complexities such as accurate placement and alignment issues during the transition from a carrier to a receive substrate.
Innovation Solution
A method and system utilizing a transfer material that forms a bubble upon exposure to light energy, allowing the die to be transferred from a carrier to a receive substrate while in contact with the bubble, and a transfer material with a reactive portion and die contact portion to support the die during the transfer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser assisted transfer is used to transfer die from carrier to receive substrate, then transfer speed and automation can be improved, but placement precision and alignment accuracy deteriorate due to complex transfer dynamics
Solution Approach 1:
A transfer material is introduced as an intermediary component between the die and the carrier. This transfer material includes a reactive portion that responds to light energy and a die contact portion that interfaces with the die. The intermediary transfer material mediates the transfer process, enabling both automated high-speed transfer and precise placement by decoupling the transfer dynamics from the final placement accuracy.
2Manufacturing precision
If traditional mechanical transfer methods are used, then placement precision can be maintained, but transfer speed and productivity deteriorate
Solution Approach 1:
The patent replaces traditional mechanical transfer systems with a light-based transfer mechanism. Light energy is used to activate the reactive portion of the transfer material, which then enables die transfer through optical-field interactions rather than mechanical forces. This substitution allows for faster transfer speeds while maintaining placement precision through optical control.
3Adaptability or versatility
If the die is transferred through air from carrier to receive substrate, then transfer flexibility can be improved, but alignment accuracy and placement control worsen due to loss of contact control
Solution Approach 1:
The transfer material is pre-positioned between the die and the carrier before the transfer process begins. The reactive portion of the transfer material is prepared to respond to light energy, and the die contact portion is already in contact with the die. This preliminary preparation ensures that when light energy is applied, the transfer occurs with maintained contact control, preserving both flexibility and alignment accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances control over the transfer process, addressing misalignment and positioning issues, providing better adhesion and controlled placement of dies on the receive substrate.
Implementation Method 1
exposing the transfer material to light energy to form a bubble in the transfer material
Data Source
AI summary
A method of transferring a die from a carrier to a receive substrate is provided. The method includes the steps of: (a) supporting a die on a carrier, a transfer material being provided between the die and the carrier; (b) exposing the transfer material to light energy to form a bubble in the transfer material; and (c) transferring the die from the carrier to a receive substrate using the bubble, the die being in contact with the bubble when the die contacts the receive substrate.