Bubble Pipe Flow Layout for Uniform 3D Substrate Processing

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in achieving uniform processing of substrates with three-dimensional structures due to insufficient liquid replacement in concave portions, leading to non-uniform etching and processing inconsistencies.

Innovation Solution

The apparatus employs a configuration of bubble generating pipes with varying gas flow rates, where outer pipes supply gas at a higher rate than inner pipes, promoting uniform bubble generation and liquid agitation to enhance processing uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single bubble generator with uniform outlets is used below the substrate, then the device complexity is reduced, but the manufacturing precision of substrate processing deteriorates due to insufficient liquid replacement in concave portions

Engineering Contradiction:
Improvebubble generator structureVSAvoidsubstrate processing uniformity
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The single bubble generator is divided into multiple bubble generating pipes (inner pipes and outer pipes) with different gas flow rates. The outer pipes located at the periphery supply higher gas flow rates than the inner pipes at the center, creating differential bubble generation that improves liquid replacement in concave portions of three-dimensional substrate structures.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate receive different gas flow rates through the segmented bubble generating pipes. The outer regions receive higher gas flow rates to enhance liquid replacement in areas where processing uniformity was previously insufficient, while inner regions receive lower gas flow rates appropriate for their processing needs.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If higher gas flow rate is supplied to outer bubble generating pipes, then the manufacturing precision of substrate processing is improved through better liquid replacement, but the use of energy increases due to differential flow rate control

Engineering Contradiction:
Improvesubstrate processing uniformityVSAvoidgas flow control system
Core Design Contradiction:
Manufacturing precisionVSUse of energy by moving object

Solution Approach 1:

The gas flow rate parameter is changed differentially across different bubble generating pipes. Outer bubble generating pipes are supplied with higher gas flow rates while inner pipes receive lower flow rates, optimizing liquid replacement efficiency and processing uniformity across the substrate surface.

Inventive Principle:
Principle #35Parameter changes

3Ease of operation

If uniform gas flow rate is supplied to all bubble generating pipes, then the ease of operation is improved, but the manufacturing precision deteriorates due to processing unevenness across the substrate surface

Engineering Contradiction:
Improvegas flow controlVSAvoidsubstrate processing uniformity
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The gas flow rate is optimized for local requirements of different substrate regions. Outer bubble generating pipes receive higher gas flow rates to address specific processing needs in peripheral and concave areas, while inner pipes receive lower flow rates, achieving overall processing uniformity that cannot be obtained with uniform gas supply.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures consistent bubble generation and liquid agitation across the substrate surface, improving etching uniformity and reducing processing inconsistencies, particularly in three-dimensional structures.

Implementation Method 1

a plurality of bubble generating pipes that each supply a gas to the processing liquid to generate bubbles in the processing liquid

Methodology Applied
Scientific EffectBubble generation: Bubble

Implementation Method 2

a flow rate of a gas supplied to an outer bubble generating pipe located below an outer region of the substrate immersed in the processing liquid differs from a flow rate of a gas supplied to an inner bubble generating pipe located below a central region of the substrate

Methodology Applied
Scientific EffectGas flow: Convection

Data Source

PatentUS12599925B2Substrate processing apparatus and substrate processing method
Publication Date: 2026.04.14 SCREEN HOLDINGS CO LTD
  • US12599925B2 patent drawing
  • US12599925B2 patent drawing
  • US12599925B2 patent drawing

AI summary

A substrate processing apparatus includes a substrate holding section that holds a substrate, a processing tank that stores a processing liquid allowing the substrate held by the substrate holding section to be immersed in, and a plurality of bubble generating pipes that each supply a gas to the processing liquid to generate bubbles in the processing liquid. Of the plurality of bubble generating pipes, a flow rate of a gas supplied to an outer bubble generating pipe located below an outer region of the substrate immersed in the processing liquid differs from a flow rate of a gas supplied to an inner bubble generating pipe located below a central region of the substrate.