Bubble-Enhanced Solvent Spraying for Substrate Drying
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Solution Overview
Problem
The challenge in semiconductor substrate manufacturing is the inefficient drying process, particularly with narrow line widths and high aspect ratios, where it is difficult to remove water using traditional heated nitrogen gas, and the use of organic solvents like isopropyl alcohol requires large quantities due to poor mixing with water.
Innovation Solution
An apparatus and method that incorporate a fluid supplying unit with a nozzle head and bubble providing element to spray isopropyl alcohol with bubbles onto the substrate, utilizing a heater, ultrasonic waves, or a membrane line to generate bubbles, facilitating easier replacement of water and reducing solvent consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If heated nitrogen gas is supplied to dry the substrate, then the drying process can be performed, but it is difficult to remove pure water between patterns with narrow line widths and high aspect ratios
Solution Approach 1:
The patent changes the chemical parameters of the drying fluid from polar (nitrogen gas) to non-polar (organic solvent like isopropyl alcohol), which has different surface tension and volatility characteristics that enable effective water removal from narrow patterns through displacement rather than evaporation
2Productivity
If a liquid organic solvent like isopropyl alcohol is used to replace pure water on the substrate, then drying efficiency can be improved, but a large amount of solvent is required due to poor mixing with polar pure water
Solution Approach 1:
The patent applies preliminary action by heating the organic solvent before application to reduce its viscosity and improve wetting characteristics, enabling better penetration and displacement of water from patterns, thereby reducing the total amount of solvent needed
Solution Approach 2:
The patent uses ultrasonic vibration applied to the substrate during solvent application to enhance mixing between the organic solvent and polar pure water, improving displacement efficiency and reducing solvent consumption through cavitation and enhanced mass transfer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances drying efficiency by creating eddies at the three-phase boundary, reducing the time and amount of organic solvent needed for drying, thus improving substrate processing efficiency and solvent savings.
Implementation Method 1
a heater provided on the organic solvent supplying line and heating the liquid organic solvent
Implementation Method 2
an ultrasonic wave applier applying ultrasonic waves to the liquid organic solvent flowing through the organic solvent supplying line
Implementation Method 3
a liquid organic solvent with great volatility and low surface tension
Implementation Method 4
a liquid organic solvent with great volatility and low surface tension
Data Source
AI summary
Provided are an apparatus and a method of cleaning a substrate. The apparatus includes a substrate supporting unit supporting a substrate, a container surrounding the substrate supporting unit and collecting an organic solvent scattered from the substrate, and a fluid supplying unit provided on one side of the container and spraying a liquid organic solvent with bubbles to the substrate. The fluid supplying unit includes a nozzle head ejecting the organic solvent to the substrate, an organic solvent supplying line supplying the organic solvent from an organic solvent storage tank to the nozzle head, and a bubble providing element provided on the organic solvent supplying line and providing bubbles to the liquid organic solvent.