Bubble Supply Pipe for Alkaline Etching Dissolved Oxygen Control

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Solution Overview

Problem

Existing substrate processing methods using acidic processing liquids do not effectively leverage the influence of dissolved oxygen concentration for efficient substrate treatment, particularly when using alkaline processing liquids.

Innovation Solution

A substrate processing method and apparatus that immerse substrates in an alkaline processing liquid and supply bubbles from multiple bubble supply pipes, adjusting the flow rate, timing, and duration of gas supply based on pre-immersion processing data using a trained model to control the concentration of dissolved oxygen, enhancing etching efficiency and uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If bubbles are supplied to alkaline processing liquid to reduce dissolved oxygen concentration, then substrate processing efficiency is improved, but device complexity increases due to multiple bubble supply pipes and control mechanisms

Engineering Contradiction:

Improvesubstrate processing efficiencyVSAvoidbubble supply system complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The processing tank is divided into multiple regions with separate bubble supply pipes for each region. Each bubble supply pipe is equipped with independent control mechanisms, allowing localized adjustment of bubble supply based on substrate processing requirements in different areas of the tank.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The bubble supply system implements dynamic control by adjusting the flow rate, timing, and duration of gas supply to each bubble supply pipe based on real-time substrate processing status. This enables adaptive optimization of dissolved oxygen concentration reduction while maintaining processing efficiency.

Inventive Principle:

Principle #15Dynamics

2Manufacturing precision

If multiple bubble supply pipes with independent control are used, then uniform etching across substrate surfaces is achieved, but ease of operation deteriorates due to complex control conditions

Engineering Contradiction:

Improveetching uniformityVSAvoidbubble supply control complexity

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The control mechanism monitors substrate processing status and dissolved oxygen concentration levels, then automatically adjusts bubble supply parameters for each pipe accordingly. This feedback-based control system maintains etching uniformity while reducing the operational burden on users.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The system controls multiple parameters including flow rate, timing, and duration of gas supply to each bubble supply pipe. By dynamically adjusting these parameters based on processing requirements, the system achieves uniform etching across substrates with varying initial thickness distributions.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If gas supply flow rate and duration are increased to reduce dissolved oxygen concentration, then processing efficiency improves, but energy consumption increases

Engineering Contradiction:

Improveprocessing efficiencyVSAvoidgas supply energy consumption

Core Design Contradiction:

ProductivityVSUse of energy by moving object

Solution Approach 1:

Instead of uniformly supplying bubbles to all regions throughout the entire processing cycle, the system applies bubble supply selectively to specific regions and time periods where dissolved oxygen reduction is most beneficial for etching uniformity. This partial action approach reduces overall energy consumption while maintaining processing efficiency.

Inventive Principle:

Principle #16Partial or excessive action

Solution Approach 2:

The bubble supply is implemented as periodic pulses rather than continuous flow, with timing and duration optimized to achieve sufficient dissolved oxygen reduction during critical processing phases. This periodic action reduces energy consumption compared to continuous gas supply.

Inventive Principle:

Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively reduces dissolved oxygen concentration in the alkaline processing liquid, increasing substrate processing efficiency and achieving uniform etching across substrate surfaces, regardless of initial thickness distribution.

Implementation Method 1

bubbles are supplied to the alkaline processing liquid from below the substrate with the substrate immersed in the alkaline processing liquid, the bubbles being supplied from a plurality of bubble holes provided in the bubble supply pipe

Methodology Applied

Scientific EffectGas-liquid contact mass transfer: Aeration

Data Source

PatentUS20230101475A1Substrate processing method and substrate processing apparatus

Publication Date: 2023.03.30 SCREEN HOLDINGS CO LTD

AI summary

A substrate processing method is executed by a substrate processing apparatus. The substrate processing apparatus includes a processing tank, and a bubble supply pipe disposed in the processing tank. In the substrate processing method, a substrate holding section immerses a substrate in an alkaline processing liquid stored in the processing tank. A bubble supply section supplies bubbles to the alkaline processing liquid from below the substrate with the substrate immersed in the alkaline processing liquid, the bubbles being supplied from a plurality of bubble holes provided in the bubble supply pipe.