Bucket Architecture With Reconfigurable PCB Module for Compact Image Capture

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Solution Overview

Problem

Image capture devices have complex and cumbersome assembly processes due to the precise placement and alignment of optical and electrical components, leading to increased form factor and discomfort during use, especially with wearable accessories.

Innovation Solution

A bucket architecture with a reconfigurable PCB module that allows for non-parallel and parallel orientations during assembly, simplifying component insertion and connection, and reducing the overall form factor through a flexible connector and U-shaped configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If traditional rigid PCB assemblies are used with fixed orientations, then structural stability is maintained, but assembly complexity increases and form factor enlarges

Engineering Contradiction:
Improveassembly complexityVSAvoidPCB structural stability
Core Design Contradiction:
Device complexityVSStability of the object's composition

Solution Approach 1:

The patent applies the dynamics principle by making the PCB module reconfigurable between different orientations (parallel and non-parallel configurations). The PCB can be assembled in a non-parallel configuration during manufacturing for easier access and visibility of components, then reconfigured to a parallel configuration in the final product for compact form factor. This dynamic adaptability resolves the contradiction between assembly ease and structural stability.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The PCB module is divided into separable components that can be assembled independently and then connected. This segmentation allows each component to be manufactured and tested separately, reducing overall assembly complexity while maintaining the stability of the final integrated structure through standardized connection interfaces.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If components are placed with precise alignment requirements, then functional performance is improved, but assembly process becomes cumbersome

Engineering Contradiction:
Improvecomponent alignment precisionVSAvoidassembly ease
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent applies preliminary action by pre-positioning alignment features and guide structures on the PCB and housing components before final assembly. These pre-formed alignment mechanisms ensure precise component placement is achieved automatically during assembly, eliminating the need for complex manual alignment procedures while maintaining high manufacturing precision.

Inventive Principle:
Principle #10Preliminary action

3Adaptability or versatility

If fixed PCB orientation is used, then manufacturing simplicity is maintained, but adaptability to different configurations is reduced

Engineering Contradiction:
ImprovePCB configuration adaptabilityVSAvoidmodule reconfigurability
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The PCB module incorporates dynamic reconfigurability through flexible connectors and movable mounting mechanisms that allow transition between parallel and non-parallel orientations. This dynamic design enables the same module to adapt to different product configurations and assembly requirements without increasing overall system complexity, as the reconfigurability is achieved through integrated design features rather than multiple separate modules.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Simplifies assembly, reduces the form factor, and enhances user comfort by allowing easier mounting and visibility of internal components, supporting a variety of accessories.

Implementation Method 1

The flexible connector includes a body portion that extends between the first and second PCB assemblies and that is flexible and allows for deformation thereof

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

a heatsink that is connected to the front housing portion and which is configured to distribute thermal energy through the image capture device

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12389102B2Bucket architecture for an image capture device including a reconfigurable PCB module
Publication Date: 2025.08.12 GOPRO INC
  • US12389102B2 patent drawing
  • US12389102B2 patent drawing
  • US12389102B2 patent drawing

AI summary

An image capture device is disclosed that includes: a front housing portion; a rear housing portion including a heatsink that is connected to the front housing portion; and a printed circuit board (PCB) module that is operatively connected to the front housing portion. The PCB module includes: a front PCB assembly; a rear PCB assembly; and a connector that extends between the front PCB assembly and the rear PCB assembly. The connector includes a flexible construction that facilitates reconfiguration of the PCB module during assembly of the image capture device between a first configuration, in which the front PCB assembly and the rear PCB assembly are oriented in non-parallel relation, and a second configuration, in which the front PCB assembly and the rear PCB assembly are oriented in generally parallel relation.