Buffer Chamber Gas Control for Stable Substrate Processing
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in effectively removing foreign substances such as particles, organic contaminants, and metal impurities, which can cause defects in substrates, affecting device performance and yield.
Innovation Solution
A substrate processing apparatus that includes a buffer chamber with a spray nozzle to apply a status improvement gas and sensors to control temperature and humidity, along with a transfer chamber for chemical treatment and a drying chamber using a supercritical fluid, enhancing substrate processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If a substrate is stored in a buffer chamber during semiconductor manufacturing processes, then the substrate can be held for subsequent processing steps, but the substrate temperature and humidity may change due to environmental conditions, affecting processing quality
Solution Approach 1:
The buffer chamber incorporates temperature and humidity sensors that continuously monitor substrate conditions. When the substrate temperature or humidity deviates from the predetermined range, the system automatically activates heating or cooling mechanisms to restore conditions within the acceptable range, ensuring consistent substrate quality throughout the manufacturing process
Solution Approach 2:
The system dynamically adjusts the buffer chamber environmental parameters (temperature and humidity) based on real-time sensor feedback. By changing these parameters automatically when they fall outside predetermined ranges, the system maintains optimal substrate conditions without manual intervention, resolving the contradiction between extended substrate storage and temperature stability
2Loss of time
If a substrate is stored in a buffer chamber during semiconductor manufacturing processes, then the substrate can be held for subsequent processing steps, but the substrate humidity may change due to environmental conditions, affecting processing quality
Solution Approach 1:
The buffer chamber incorporates humidity sensors that continuously monitor substrate humidity levels. When humidity deviates from the predetermined range, the system automatically activates dehumidification or humidification mechanisms to restore conditions within the acceptable range, ensuring consistent substrate quality throughout the manufacturing process
Solution Approach 2:
The system dynamically adjusts the buffer chamber environmental parameters (temperature and humidity) based on real-time sensor feedback. By changing these parameters automatically when they fall outside predetermined ranges, the system maintains optimal substrate conditions without manual intervention, resolving the contradiction between extended substrate storage and processing quality
3Quantity of substance
If multiple substrates are stored in buffer slots, then substrate capacity is increased, but it becomes difficult to monitor and control the state of each individual substrate
Solution Approach 1:
The buffer chamber is divided into multiple independent buffer slots, each equipped with its own temperature and humidity sensors. This segmentation allows individual monitoring of substrate conditions in each slot, enabling the system to track and control the state of multiple substrates simultaneously without cross-contamination of environmental data
Solution Approach 2:
The buffer chamber system provides universal monitoring capabilities across all buffer slots through a centralized control system that receives data from multiple sensors. This multi-functional approach allows simultaneous monitoring and control of multiple substrates with different conditions, maintaining quality assurance while maximizing storage capacity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively manages temperature and humidity to improve substrate processing, reducing defects and enhancing the performance and yield of semiconductor devices.
Implementation Method 1
a spray nozzle disposed on the buffer frame and configured to spray a status improvement gas in a buffer slot of the plurality
Implementation Method 2
at least one buffer side sensor disposed on the buffer frame and configured to detect the state of a substrate positioned in the buffer slot
Implementation Method 3
a drying chamber connected to the transfer chamber and configured the substrate using a fluid in a supercritical state
Implementation Method 4
a liquid treatment chamber and configured to treat the substrate by using chemicals
Data Source
AI summary
A substrate processing apparatus according to an embodiment includes an index module including a load port configured to receive a substrate carrier, and a process module connected to the index module, the process module including a transfer chamber, a process chamber, and a buffer chamber. The process chamber is connected to the transfer chamber and the buffer chamber is disposed between the index module and the transfer chamber. The transfer chamber includes a transfer robot configured to transfer a substrate between the buffer chamber and the process chamber. The buffer chamber includes a buffer frame including a plurality of buffer slots, a spray nozzle disposed on the buffer frame and configured to spray a status improvement gas into a buffer slot of the plurality, and at least one buffer side sensor disposed on the buffer frame and configured to detect a state of a substrate positioned in the buffer slot.