Semiconductor Buffer Chamber Purge Gas Flow Control

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Solution Overview

Problem

Current semiconductor fabrication processes face challenges in achieving uniform distribution of purge gases within buffer chambers, leading to inefficient gas permeation and potential variations in semiconductor device quality due to asymmetrical arrangements of purge and pump ports.

Innovation Solution

The implementation of asymmetrical and symmetrical arrangements of purge and pump ports, combined with flow enhancers that direct purge gases in radial directions, promotes uniform gas distribution within the buffer chamber, enhancing the permeation and evacuation of gases.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If asymmetrical arrangement of purge and pump ports is used, then gas flow direction is controlled, but uniform gas distribution is compromised

Engineering Contradiction:
Improvegas flow controlVSAvoidgas distribution uniformity
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The patent applies asymmetry by positioning the purge port and pump port at different locations within the buffer chamber, specifically with the purge port offset from direct opposition to the pump port. This asymmetrical arrangement creates a controlled flow path that directs gas through the chamber more effectively, improving gas distribution uniformity while maintaining operational control.

Inventive Principle:
Principle #4Asymmetry

2Device complexity

If purge port and pump port are positioned directly opposite each other, then structural simplicity is maintained, but gas permeation efficiency is reduced

Engineering Contradiction:
Improveport arrangement simplicityVSAvoidgas permeation efficiency
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The patent positions the purge port at an offset location rather than directly opposite the pump port, creating an asymmetrical configuration. This offset positioning extends the gas flow path through the buffer chamber, allowing better gas permeation and distribution efficiency while maintaining relatively simple structural implementation.

Inventive Principle:
Principle #4Asymmetry

3Manufacturing precision

If flow enhancers are added to direct gas flow, then gas distribution uniformity is improved, but device complexity increases

Engineering Contradiction:
Improvegas distribution uniformityVSAvoidchamber component quantity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent introduces flow enhancers at specific strategic locations within the buffer chamber rather than throughout the entire chamber. These localized flow enhancement features are positioned to target specific flow patterns, improving gas distribution uniformity in critical areas while minimizing the overall increase in device complexity.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures a more uniform distribution of purge gases, improving the consistency and quality of semiconductor device fabrication by controlling gas flow patterns and reducing variations within the buffer chamber.

Implementation Method 1

a first flow enhancer that, when arranged adjacent to the purge port, directs the purge gas flowing in an axial direction along a longitudinal axis of the purge port into the buffer chamber in a plurality of radial directions relative to the longitudinal axis

Methodology Applied
Scientific EffectFluid flow direction control:

Implementation Method 2

A partial vacuum at a pump port formed in a floor defining the buffer chamber draws a portion of the purge gas from the buffer chamber

Methodology Applied
Scientific EffectPressure differential-driven flow: Pressure Gradient

Data Source

PatentUS11735436B2Semiconductor fabrication apparatus
Publication Date: 2023.08.22 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US11735436B2 patent drawing
  • US11735436B2 patent drawing
  • US11735436B2 patent drawing

AI summary

An apparatus for fabricating a semiconductor device has a housing defining a buffer chamber, a plurality of reactor ports formed in the housing for establishing interfaces with a plurality of process chambers that are to receive a wafer during a fabrication process to fabricate the semiconductor device, a wafer positioning robot positioned within the buffer chamber to transport the wafer between the plurality of process chambers through the plurality of reactor ports, a purge port formed in the housing for introducing a purge gas into the buffer chamber, a pump port formed in the housing for exhausting a portion of the purge gas from the buffer chamber, and a first flow enhancer that directs the purge gas flowing in an axial direction along a longitudinal axis of the purge port into the buffer chamber in a plurality of radial directions relative to the longitudinal axis.