Buffer Chamber for Substrate Wetting and Transfer
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Solution Overview
Problem
Current substrate treatment methods face challenges in maintaining uniformity and efficiency, particularly in preventing pattern leaning and watermark formation during the transfer of substrates with high aspect ratio patterns, and in minimizing contamination of transfer robots and hands during batch-to-single-type treatment transitions.
Innovation Solution
A substrate treating apparatus incorporating a buffer chamber with a chuck for rotating substrates and liquid supply units for maintaining a wetting state, using a first liquid for the top surface and a second, more volatile liquid for the bottom surface, along with a posture change robot and transfer robots with multiple hands to manage substrate posture and transfer effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If batch-type treating method is used to improve mass treatment efficiency, then productivity increases, but pattern leaning occurs on high aspect ratio patterns
Solution Approach 1:
The treatment process is segmented into batch-type treatment and single-type treatment stages. The buffer chamber enables substrates to be transferred one by one from the batch treatment bath, allowing high aspect ratio patterns to be treated without leaning while maintaining overall productivity through continuous processing.
Solution Approach 2:
The buffer chamber acts as an intermediary between the batch-type treating bath and the single-type treating chamber. It receives substrates from batch treatment, maintains them in a wet state, and transfers them individually, thus preventing pattern leaning while preserving mass treatment efficiency.
2Productivity
If batch-type treating method is used to improve mass treatment efficiency, then productivity increases, but watermark generation occurs when substrates are exposed to air
Solution Approach 1:
The buffer chamber performs preliminary action by maintaining substrates in a wet state immediately after batch treatment and before single-type treatment. This preliminary wet state maintenance prevents watermark generation when substrates are subsequently exposed to air during individual processing.
Solution Approach 2:
The buffer chamber serves as an intermediary that prevents direct exposure of treated substrates to air. By keeping substrates in a controlled wet environment during transfer, it eliminates watermark formation while allowing continuous high-volume processing.
3Manufacturing precision
If single-type treating method is used to prevent pattern leaning, then manufacturing precision improves, but mass treatment efficiency decreases
Solution Approach 1:
The overall treatment process is segmented into two stages: batch-type treatment for mass processing and single-type treatment for precision processing. The buffer chamber connects these stages, allowing substrates to be treated in batches first, then transferred individually for final processing, thus achieving both high productivity and precision.
Solution Approach 2:
The invention merges the advantages of both batch-type and single-type treating methods by combining them in a sequential process. The buffer chamber enables this combination by facilitating smooth transition from batch to single processing while maintaining substrate wet state, thereby achieving both mass treatment efficiency and pattern precision.
4Manufacturing precision
If substrate is rotated in single-type treating method to improve treatment uniformity, then manufacturing precision improves, but pattern collapse risk increases for high aspect ratio patterns
Solution Approach 1:
The buffer chamber performs preliminary action by maintaining substrates in a wet state before they enter the single-type treating chamber. This preliminary wetting prevents pattern collapse during rotation by providing structural support to high aspect ratio patterns, enabling safe rotation for uniform treatment.
Solution Approach 2:
The buffer chamber provides beforehand cushioning by keeping substrates wet immediately after batch treatment. This wet cushioning protects high aspect ratio patterns from collapse when they are subsequently rotated in the single-type treating chamber, allowing uniform treatment without pattern damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the evenness of treatment quality between substrates, minimizes pattern leaning and watermark issues, and reduces contamination risks during transfer, enabling efficient treatment of substrates with high aspect ratio patterns and improving mass production capabilities.
Implementation Method 1
supplying a liquid to a substrate so that a wetting state of the substrate is maintained
Implementation Method 2
a chuck for supporting and rotating the substrate
Implementation Method 3
a second liquid supply unit configured to supply a second liquid, which has a higher volatility than the first liquid, to a second surface, which is different from the first surface, of the substrate
Data Source
AI summary
The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a batch-type treating bath for treating a substrate in a batch-type manner; a single-type treating chamber for treating the substrate in a single-type manner; and a buffer chamber positioned on a transfer path of the substrate transferred between the batch-type treating bath and the single-type treating chamber, and supplying a liquid for maintaining a wetting state of the substrate.