Buffer Chamber Unit for Wafer Processing
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Solution Overview
Problem
Conventional buffer chamber units for wafer processing equipment require stopping the processing equipment for separation and recoupling, necessitate correction and verification operations, may not accurately recouple, can unevenly heat wafers, and allow foreign substances to contaminate the wafer during processing.
Innovation Solution
A buffer chamber unit with a detachable chamber member and door member that allows for separation and recoupling without stopping the equipment, includes a detection sensor for accurate coupling, and a design that prevents foreign substances from reaching the wafer by directing air discharge around it, with uniform heating capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If the buffer chamber unit is separated from the EFEM unit for maintenance or replacement, then the buffer chamber unit can be cleaned or replaced, but the wafer processing equipment must be stopped and the EFEM unit is open to the outside
Solution Approach 1:
The buffer chamber unit is divided into separable components (buffer chamber, door assembly, heating assembly) that can be independently removed and maintained without affecting the entire wafer processing equipment. The door assembly can be detached from the buffer chamber unit, allowing maintenance of individual components while keeping the system operational.
Solution Approach 2:
The buffer chamber unit includes pre-configured heating assemblies and door assemblies that can be quickly installed and activated. The heating assembly is pre-positioned to heat wafers before they enter the process chamber, and the door assembly is pre-equipped with sealing mechanisms to maintain vacuum integrity upon reconnection.
2Ease of repair
If the buffer chamber unit is reconnected to the EFEM unit after maintenance, then the buffer chamber unit can resume operation, but a teaching operation for the robot arm is required and recoupling accuracy is poor
Solution Approach 1:
The buffer chamber unit incorporates position detection mechanisms and alignment features that provide feedback during the recoupling process. The detection sensor member detects the position of the buffer chamber unit relative to the EFEM unit, enabling automatic alignment and reducing the need for manual teaching operations of the robot arm.
Solution Approach 2:
The patent replaces manual teaching operations and mechanical alignment procedures with automated detection and positioning systems. The detection sensor member and alignment features automatically guide the recoupling process, substituting complex mechanical teaching operations with sensor-based positioning.
3Object-generated harmful factors
If the outlet is formed on the rear surface of the buffer chamber unit to discharge air containing toxin and outgas, then the buffer chamber unit can remove toxins from wafers, but foreign substances pass through the wafer and cause faulty
Solution Approach 1:
The heating assembly is positioned to create a localized heated region within the buffer chamber unit. The heating assembly heats wafers at specific locations before they enter the process chamber, while the outlet is positioned to discharge gases away from the wafer path. This spatial differentiation allows toxin removal without contaminating the wafer.
Solution Approach 2:
The patent introduces a vertical dimension to the gas flow path by positioning the outlet on the rear surface of the buffer chamber unit, perpendicular to the wafer transfer direction. This three-dimensional arrangement allows toxic gases to be discharged in a direction that does not intersect with the wafer path, preventing contamination while maintaining effective toxin removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables continuous operation of wafer processing equipment during buffer chamber unit separation and recoupling, ensures accurate and quick recoupling, prevents wafer contamination, and ensures uniform heating of wafers.
Implementation Method 1
when there is a need to heat a wafer that is provided to the buffer chamber unit
Data Source
AI summary
The present invention relates to a buffer chamber unit for wafer processing equipment.