Buffer Chip Timing Calibration for High-Capacity Memory Packages

A buffer chip is introduced as an intermediary component between the memory controller and memory chips. The buffer chip includes a control signal transmission path for control signals and a data transmission path for data, with separate variable delay circuits that can independently adjust delays. This intermediary structure allows memory capacity to be increased while maintaining low latency by buffering and timing-adjusting signals before they reach the memory chips.

The memory system is segmented into distinct functional components: a memory controller, a buffer chip, and multiple memory chips. The buffer chip itself is segmented into separate control signal transmission path and data transmission path with independent variable delay circuits. This segmentation allows for modular manufacturing and assembly, reducing overall manufacturing complexity and cost while enabling increased memory capacity through multiple memory chips.

The variable delay circuits adjust delay values by changing parameters such as delay code inputs and internal timing characteristics. The control signal transmission path and data transmission path have independent variable delay circuits that can be programmed with different delay codes to optimize signal timing. This parameter-based adjustment mechanism provides flexible timing optimization without requiring complex structural changes to the circuit architecture.

The buffer chip is divided into separate control signal transmission path and data transmission path, with each path having its own variable delay circuit. This segmentation physically separates control signals from data signals, reducing electromagnetic interference and crosstalk between signal types. The separate paths improve signal transmission reliability while the modular design keeps the overall device complexity manageable through systematic organization.