Buffer Interconnect Via Formation in IC Packaging
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Solution Overview
Problem
Conventional integrated circuit packaging systems face challenges in miniaturization, reliability, and cost due to damage caused by via formation processes like laser ablation and mechanical drilling, which affect yield and performance.
Innovation Solution
The introduction of a buffer interconnect attached to the substrate and encapsulation, which forms a physical barrier to protect underlying components during via formation, reducing damage and enabling a more stable and efficient manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If via formation processes like laser ablation and mechanical drilling are used, then vias can be formed to connect to buffer interconnect, but damage is caused to underlying components reducing yield and reliability
Solution Approach 1:
The patent applies beforehand cushioning by forming a recess in the encapsulation material at the location where the via will be formed, and optionally placing a buffer material in the recess. This cushioning structure prevents the via formation process (laser ablation or mechanical drilling) from damaging the underlying buffer interconnect and substrate, thereby maintaining reliability while enabling precise via formation.
Solution Approach 2:
The patent applies preliminary action by pre-forming the recess and buffer material structure before the via formation process. This preliminary preparation ensures that when the via is subsequently formed through laser ablation or drilling, the underlying components are already protected, preventing damage and improving yield without compromising via formation precision.
2Reliability
If via depth is increased to reach buffer interconnect, then connection is achieved, but process sensitivity increases and manufacturing becomes more difficult
Solution Approach 1:
The recess and buffer material structure provides beforehand cushioning that allows via formation with reduced via depth. The buffer material extends into the via, providing electrical connection without requiring the via to penetrate as deeply into the encapsulation, thereby reducing process sensitivity and manufacturing difficulty while maintaining reliable connection.
Solution Approach 2:
The buffer material acts as an intermediary between the via and the buffer interconnect. It provides a transition zone that facilitates electrical connection while reducing the required via depth, making the via formation process less sensitive and easier to manufacture with standard processes.
3Volume of moving object
If miniaturization is pursued to reduce package size, then product size decreases, but manufacturing complexity and cost increase
Solution Approach 1:
The patent applies segmentation by dividing the encapsulation structure into distinct regions: the main encapsulation body and a recess portion. This segmentation allows for simplified via formation processes and buffer material placement, reducing manufacturing complexity while enabling compact package design through efficient space utilization.
Solution Approach 2:
The patent applies nesting by placing the buffer material inside the recess within the encapsulation structure. This nested arrangement allows multiple functional elements (encapsulation, recess, buffer material, via) to be integrated in a compact configuration, achieving miniaturization without proportionally increasing manufacturing complexity.
4Manufacturing precision
If buffer interconnect is exposed during via formation, then via connection is achieved, but damage to substrate and underlying layers occurs
Solution Approach 1:
The buffer material in the recess provides beforehand cushioning that protects the buffer interconnect and underlying substrate during via formation. The via can be formed with precise connection to the buffer interconnect while the buffer material absorbs or deflects harmful effects from laser ablation or mechanical drilling, preventing damage to underlying components.
Solution Approach 2:
The buffer material serves as an intermediary protective layer between the via formation process and the underlying components. It allows precise via connection to the buffer interconnect while mediating and reducing the harmful effects of the via formation process on the substrate and other underlying layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances reliability, improves yield, reduces costs, and simplifies the manufacturing process by minimizing damage and process sensitivity, while allowing for a wider process window and reduced via depth.
Implementation Method 1
The introduction of a buffer interconnect attached to the substrate and encapsulation, which forms a physical barrier to protect underlying components during via formation
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; attaching a buffer interconnect to and over the substrate; forming an encapsulation over the substrate covering the buffer interconnect and the integrated circuit; and forming a via in the encapsulation and to the buffer interconnect.