Buffer Layer Hollow Design for Under-screen Camera Stress Reduction
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Solution Overview
Problem
Under-screen camera designs in OLED display devices suffer from low transmittance and image quality due to film structures, leading to reduced pixel density and reliability issues during hole cutting, which affects the integrity and effectiveness of the display device.
Innovation Solution
A display panel design with buffer layers between film layers to be cut and protected, employing a hollow structure in the transparent displaying region to reduce stress and improve reliability, featuring transparent organic photoresist material and specific hole shapes and recesses to minimize cutting stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If under-screen camera design is implemented with film structures (array substrate, light emitting layer, polarizer), then camera function is integrated into display region, but transmittance decreases and image quality deteriorates
Solution Approach 1:
The display panel is divided into main displaying region and transparent displaying region. The transparent displaying region has reduced film layer density or removed film layers to create higher transmittance, allowing camera light to pass through while the main displaying region maintains full display functionality.
Solution Approach 2:
Different regions of the display panel have different structural characteristics. The transparent displaying region has localized modifications (reduced pixel density, removed film layers) to optimize for camera light transmission, while the main displaying region maintains standard structure for optimal display performance.
2Adaptability or versatility
If under-screen camera design is implemented with reduced pixel density in camera region, then camera function is enabled, but effective displaying area is reduced
Solution Approach 1:
The display panel is segmented into main displaying region and transparent displaying region. The transparent displaying region, while having reduced display functionality, provides optical transparency for camera light transmission, effectively converting a potentially wasted area into a functional optical pathway.
3Ease of manufacture
If cutting methods (laser cutting, mechanical cutting) are used to form holes in film layers, then holes are created for camera region, but cutting stress damages other film layers and reduces reliability
Solution Approach 1:
The harmful cutting process is extracted and removed from the manufacturing sequence. Instead of cutting holes through completed film layers, the patent forms holes in the base layer first, then sequentially adds buffer layers that are pre-formed with corresponding hollow regions, eliminating the need for subsequent cutting operations that would stress other film layers.
Solution Approach 2:
Buffer layers are formed with hollow regions corresponding to camera regions before the cutting process. This preliminary action prepares the structure to accommodate future holes without requiring cutting through sensitive film layers, thereby preventing stress-induced damage.
4Reliability
If buffer layers with hollow regions are added between film layers, then cutting stress is reduced and reliability is improved, but device structure becomes more complex
Solution Approach 1:
Buffer layers serve as intermediary structures between the base layer and subsequent film layers. These buffer layers with hollow regions act as stress-absorbing intermediaries that protect sensitive film layers from cutting stress while maintaining the overall structural integrity and functionality of the display panel.
Data Source
AI summary
The present invention provides a display panel. At least one first buffer layer is disposed between the base layer and the thin film transistor layer. At least one second buffer layer is disposed between the functional layer and the polarizer. The first buffer layer and the second buffer layer use hollow designs in the transparent displaying region and can reduce stress generated from cutting a hole, improve protection for the display panel and finally improve reliability of the display device.


