Multilayer Buffer Structure for Through-Hole Substrate Adhesion
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Solution Overview
Problem
Existing electronic devices face challenges in enhancing structural strength and adhesion capability between substrates and film layers, particularly due to differences in thermal expansion coefficients, leading to issues like substrate cracking and interface delamination during manufacturing processes.
Innovation Solution
Incorporation of a buffer layer composed of multiple sublayers, including organic and inorganic materials, between the substrate and conductive layers to absorb stress and enhance adhesion, thereby reducing cracking and delamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a single-layer structure is used without buffer layers, then the device structure is simple and manufacturing is easier, but the structural strength is insufficient and adhesion capability is poor leading to substrate cracking and interface delamination
Solution Approach 1:
The buffer layer is divided into multiple sublayers (first buffer sublayer, second buffer sublayer, third buffer sublayer) with different materials and functions. Each sublayer addresses specific stress and adhesion requirements, allowing the system to achieve enhanced structural strength while managing complexity through functional segmentation rather than using a single complex material system.
Solution Approach 2:
The buffer layer employs composite material structure combining organic materials (polyimide, parylene) and inorganic materials (silicon oxide, silicon nitride) in different sublayers. This composite approach enables the buffer layer to simultaneously provide stress absorption, adhesion enhancement, and thermal expansion mismatch management, resolving the contradiction between strength enhancement and structural simplicity.
2Reliability
If buffer layers are added to enhance adhesion capability, then adhesion between substrate and film layers is improved, but the device structure becomes more complex
Solution Approach 1:
Different sublayers of the buffer layer are designed with specific local qualities tailored to their functions: the first buffer sublayer contacts the substrate for adhesion enhancement, the second buffer sublayer provides stress absorption, and the third buffer sublayer interfaces with conductive layers. This local quality differentiation allows each region to optimize for its specific requirement, improving adhesion capability while keeping the overall structure manageable through functional specialization.
3Reliability
If multiple buffer sublayers are used to absorb stress and enhance adhesion, then reliability is improved, but manufacturing process becomes more complex
Solution Approach 1:
The buffer layer structure is designed and prepared in advance before depositing the conductive layers and other film structures. By establishing the multi-sublayer buffer structure beforehand, the system pre-absorbs thermal expansion stresses and creates optimized adhesion interfaces, allowing subsequent manufacturing steps to proceed with reduced risk of defects and simpler process control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer layer effectively enhances the structural strength and adhesion capability of the substrate, improving the reliability and integrity of the electronic device by mitigating stress-induced failures during manufacturing processes.
Implementation Method 1
the buffer layer 130 may enhance structural strength of the substrate 110 or may enhance an adhesion capability between the substrate 110 and other film layers
Implementation Method 2
the buffer layer 130 may enhance structural strength of the substrate 110 or may enhance an adhesion capability between the substrate 110 and other film layers
Data Source
AI summary
An electronic device includes a substrate, a through hole, a buffer layer, a first circuit structure, and an electronic component. The substrate includes a first side and a second side opposite to the first side. The through hole penetrates the substrate. The buffer layer is disposed on the first side of the substrate, the second side of the substrate, and an inner wall of the through hole. The first circuit structure is disposed on the first side. The electronic component is disposed on the first circuit structure. The buffer layer includes a plurality of layers.