Buffer Plate for Flexible Display Thermal Stress Management
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Solution Overview
Problem
Existing display devices face challenges in maintaining the quality and integrity of flexible display panels when mounted on surfaces with different thermal expansion coefficients, leading to issues like warpage, distortion, and creases due to environmental changes and heat generated by the display panel.
Innovation Solution
The implementation of a display device structure that includes an organic light-emitting element over a thin flexible film, a member with a curved surface made of a different organic resin material, and a buffer plate with a specific thickness to absorb thermal stress and maintain the display panel's shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible display panel is mounted on a member with different thermal expansion coefficient, then the display device can be mounted on various surfaces including curved surfaces, but warpage and distortion occur due to thermal stress
Solution Approach 1:
A buffer plate is introduced as an intermediary component between the flexible display panel and the member. This buffer plate has a thickness of 0.1 mm to 2.5 mm and is made of a material with appropriate mechanical properties to absorb thermal stress and prevent direct transmission of stress to the display panel, thereby preventing warpage and distortion while allowing mounting on curved surfaces.
2Reliability
If the buffer plate thickness is increased to absorb more thermal stress, then the protection against warpage improves, but the heat dissipation efficiency decreases
Solution Approach 1:
The buffer plate thickness is optimized within the range of 0.1 mm to 2.5 mm. This parameter optimization balances two competing requirements: sufficient thickness to absorb thermal stress and prevent warpage, while maintaining thinness to allow heat dissipation from the display panel. The specific thickness range represents an optimal compromise between these conflicting requirements.
3Weight of moving object
If the display panel is made thinner and lighter, then the weight reduction and flexibility improve, but the resistance to thermal stress decreases
Solution Approach 1:
The buffer plate serves as a protective intermediary that compensates for the reduced thermal stress resistance of the thin flexible display panel. By positioning the buffer plate between the panel and the mounting member, it absorbs and distributes thermal stress, allowing the display panel to remain thin and lightweight without compromising its durability against thermal expansion differences.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the occurrence of creases and warpage, enhances heat dissipation, and maintains the reliability and quality of the flexible display panel, even when exposed to varying environmental conditions.
Implementation Method 1
a buffer plate with a specific thickness to absorb thermal stress and maintain the display panel's shape
Implementation Method 2
enhances heat dissipation
Data Source
AI summary
When a base film used in a flexible display panel is bonded to a resin member for fixing the base film that is curved, the base film has creases by an environmental change such as temperature due to difference in linear expansion coefficient before and after a thermal shock. A buffer plate that is thin enough to be bent is provided between the base film used in a flexible display panel and the resin member. With the use of heat dissipation effect and heat equalization effect of the buffer plate, a structure around the panel capable of resisting the environmental change can be provided.