Buffer Component Recess for Uniform Heat Distribution in Electronic Devices
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Solution Overview
Problem
In conventional electronic devices, heat generated by different electronic elements affects each other, leading to increased local temperatures and negatively impacting user experience.
Innovation Solution
The electronic device incorporates a buffer component with a recess, reducing direct or indirect contact areas between the buffer component and the electronic elements, thereby decreasing heat transfer efficiency and minimizing the impact of heat on user experience.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the buffer component is used to transfer heat from electronic elements to the housing, then heat dissipation is improved, but local temperature increases and affects user experience
Solution Approach 1:
The buffer component is segmented into multiple regions with different thermal conductivities. The first region (first buffer portion) has higher thermal conductivity for efficient heat transfer, while the second region (second buffer portion) has lower thermal conductivity to reduce heat transfer to the housing, creating a gradient structure that balances heat dissipation and user comfort
Solution Approach 2:
Different portions of the buffer component are assigned different thermal properties tailored to their specific functions. The first buffer portion is designed with higher thermal conductivity to handle heat from high-power elements, while the second buffer portion uses lower thermal conductivity material to protect the housing and improve user experience in contact areas
2Volume of moving object
If electronic elements are arranged closely to save space, then device compactness is improved, but heat interference between elements increases
Solution Approach 1:
The buffer component is divided into multiple independent buffer portions, each positioned between specific electronic elements. This segmentation creates thermal isolation zones that prevent heat interference between closely spaced elements while maintaining compact device dimensions
Solution Approach 2:
The buffer component acts as an intermediary thermal management layer between electronic elements and the housing. It mediates heat transfer by providing controlled thermal pathways, allowing heat to be dissipated efficiently while preventing harmful heat interference between components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The recess in the buffer component effectively reduces heat transfer efficiency, leading to more uniform heat distribution, lower local temperatures of electronic elements, and improved user experience by reducing the likelihood of device overheating.
Implementation Method 1
a buffer component, where the buffer component is connected to the housing... Disposing the recess can reduce a direct or an indirect contact area between the buffer component and the first electronic element and/or a direct or an indirect contact area between the buffer component and the second electronic element, to reduce heat transfer efficiency
Data Source
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AI summary
This application relates to an electronic device. The electronic device includes a housing, a buffer component is connected to the housing, a first electronic element is located on a side that is of the buffer component and that is away from the housing, and a second electronic element is located on a side that is of the housing and that is away from the buffer component. The buffer component has a recess, and at least a part of a front projection of the second electronic element in a thickness direction of the electronic device falls within a front projection of the recess. Disposing the recess can reduce a direct or an indirect contact area between the buffer component and the first electronic element and/or a direct or an indirect contact area between the buffer component and the second electronic element, to reduce heat transfer efficiency of a corresponding region of the buffer component and reduce heat transfer efficiency of the electronic device in the thickness direction, thereby making heat more uniform in a non-thickness direction, reducing a possibility that a local temperature of the first electronic element is relatively high, and improving heat experience of a user.