Buffer Spring Pad for Electronic Device Packages
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Solution Overview
Problem
As electronic device packages are scaled down, the reduced size of bumps leads to increased physical stress and impact, causing cracks, delamination, and crystalline defects, which degrade the reliability of the packages.
Innovation Solution
Incorporating a buffer spring pad portion with alternately stacked conductive material layers between the substrate and bumps to alleviate stress, preventing its transmission to the active regions of the semiconductor substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of bumps is reduced to scale down electronic device packages, then the height and size of bumps are reduced, but physical stress and impact increase causing cracks, delamination, and crystalline defects
Solution Approach 1:
A buffer spring pad portion is introduced as an intermediary element between the bump and the contact portion on the substrate. This buffer spring pad absorbs and mitigates the physical stress and impact generated by the bump, preventing direct transmission to the substrate and avoiding cracks, delamination, and crystalline defects while maintaining the reduced bump size.
Solution Approach 2:
The buffer spring pad is pre-positioned between the bump and the contact portion before operation. This structure provides beforehand cushioning by absorbing stress and impact before they can cause damage to the substrate, contact portions, or active regions, thereby preventing reliability issues in advance.
2Volume of moving object
If the size of bumps is reduced, then package size is scaled down, but physical stress concentrates on contact portions causing cracks and delamination
Solution Approach 1:
The buffer spring pad serves as a mediator between the bump and the contact portion, distributing the concentrated physical stress over a larger area and reducing peak stress on the contact portions. This prevents cracks and delamination while allowing the use of smaller bumps for package scaling.
3Productivity
If the size of bumps is reduced, then integration density increases, but impact generates crystalline defects in active regions
Solution Approach 1:
The buffer spring pad acts as a protective intermediary that absorbs impact energy before it reaches the active regions of the substrate. This prevents the generation of crystalline defects such as dislocations in the semiconductor substrate, enabling higher integration density with smaller bumps without compromising crystal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer spring pad portion effectively reduces stress by up to 93.4% in electronic device packages, enhancing contact reliability and preventing cracks and delamination.
Implementation Method 1
a buffer spring pad portion between the first contact portion of the first substrate and the first contact surface of the bump. The buffer spring pad portion includes at least two different conductive material layers which are stacked
Data Source
AI summary
Electronic device packages and related methods are provided. The electronic device package includes a first substrate having a first contact portion disposed thereon, a bump having a first contact surface connected to the first contact portion and a second contact surface disposed opposite to the first contact surface, and a buffer spring pad portion between the first contact portion of the first substrate and the first contact surface of the bump. The buffer spring pad portion includes at least two different conductive material layers which are stacked.