Buffer Storage Control for Preprocessed Bonding Surfaces
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Solution Overview
Problem
The surface condition of electronic components and mounting boards can change over time due to deactivation and organic substance attachment, leading to reduced bonding strength and potential bonding failures during the mounting process, and timing discrepancies in preprocessing can exacerbate these issues.
Innovation Solution
A buffer apparatus and preprocessing method that includes a storage with independent temperature, humidity, and pressure control, along with cleaning and surface processing units, to maintain the active state of components and boards before bonding, and a control unit to reprocess if necessary.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If preprocessing is performed on electronic components and mounting boards, then bonding strength is improved, but surface condition deteriorates over time due to deactivation and organic substance attachment
Solution Approach 1:
The patent performs preprocessing (activation and purification) in advance before bonding, and stores the components in a buffer apparatus to maintain their active state until bonding occurs. This preliminary action ensures the surface is properly prepared while the buffer prevents degradation over time.
Solution Approach 2:
The buffer apparatus creates an inert environment by controlling temperature, humidity, and gas composition (using nitrogen or other inert gases) to prevent deactivation and organic substance attachment on the preprocessed surfaces, thereby maintaining bonding strength over time.
2Device complexity
If electronic components and mounting boards are stored in a common chamber, then device complexity is reduced, but surface condition control deteriorates due to inability to adjust storage conditions independently
Solution Approach 1:
The patent divides the storage system into separate buffer apparatus for electronic components and mounting boards, each with independent environmental control. This segmentation allows different storage conditions to be optimized for each component type while maintaining overall system reliability.
Solution Approach 2:
The buffer apparatus dynamically adjusts temperature, humidity, and gas composition independently for different stored items based on their specific requirements. This dynamic control ensures optimal surface condition maintenance for each component type despite varying storage needs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces bonding failures by maintaining the active state of electronic components and mounting boards, ensuring consistent bonding strength through controlled storage environments and timely reprocessing.
Implementation Method 1
a storage adjustment unit that adjusts temperature, humidity, and pressure of gas inside the storage independently from the chamber
Implementation Method 2
a storage adjustment unit that adjusts temperature, humidity, and pressure of gas inside the storage independently from the chamber
Implementation Method 3
a storage adjustment unit that adjusts temperature, humidity, and pressure of gas inside the storage independently from the chamber
Implementation Method 4
The activation process is a process to activate surfaces of the electronic component and the mounting board using active species such as ions and radicals generated by turning reaction gas into plasma
Implementation Method 5
The activation refers to the breaking of chemical bonds of molecules on the surface
Implementation Method 6
The purification refers to the removal of particles attached to the surface by bouncing them or the removal of organic substances by degrading them
Implementation Method 7
The purification refers to the removal of particles attached to the surface by bouncing them or the removal of organic substances by degrading them
Data Source
AI summary
A buffer apparatus, a preprocessing apparatus, a mounting apparatus, a preprocessing method and a mounting method that can reduce bonding failure due to time elapsed from preprocessing of an electronic component and a mounting board to a bonding process. The buffer apparatus of the present embodiment includes a storage 161 that stores a component supply body TW that is a workpiece which is a wafer W diced into an electronic component E attached on a tape T attached to a ring R, and a mounting board BW that is a workpiece on which the electronic component E released from the component supply body TW is mounted after surface processing and/or a cleaning process; a chamber 162 that houses the storage 161; and a storage adjustment unit 163 that adjusts temperature, humidity, and pressure of gas inside the storage 161 independently from the chamber 162.