Buffered Chip Guard Structure to Mitigate Dicing Cracks
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Solution Overview
Problem
As semiconductor devices become larger in capacity and more highly integrated, the height of the chip guard increases, leading to an increase in defects due to chip guard cracks during the dicing process.
Innovation Solution
A semiconductor device design featuring a substrate with a first and second conductive chip guard pattern, separated by a buffer layer, to enhance structural stability and protect the integrated circuit from stress and moisture during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the chip guard height is increased to protect the integrated circuit from stress and moisture, then the protective function is improved, but the occurrence of chip guard cracks increases
Solution Approach 1:
The chip guard is divided into multiple segments (first conductive chip guard pattern and second conductive chip guard pattern) separated by a buffer layer. This segmentation allows each segment to independently manage stress, preventing crack propagation while maintaining the overall protective function of the chip guard structure.
Solution Approach 2:
A buffer layer is introduced as an intermediary element between the first and second conductive chip guard patterns. This buffer layer acts as a stress-absorbing medium that prevents direct stress transmission between the conductive patterns, thereby reducing crack formation while preserving the protective barrier function.
2Stability of the object's composition
If a single continuous chip guard pattern is used, then the structural integrity is maintained, but stress concentration leads to cracks
Solution Approach 1:
The continuous chip guard pattern is segmented into multiple conductive patterns separated by buffer layers. This segmentation maintains structural integrity by preserving the encirclement of the integrated circuit while distributing stress across multiple independent segments, preventing stress concentration that leads to cracks.
Solution Approach 2:
Different regions of the chip guard structure are assigned different properties: the conductive patterns provide electrical functionality and structural support, while the buffer layer regions provide stress absorption and crack prevention. This local differentiation optimizes both structural integrity and crack resistance.
Data Source
AI summary
A semiconductor device includes a substrate. The semiconductor device also includes a first conductive chip guard pattern over a chip guard region of the substrate. The semiconductor device further includes a second conductive chip guard pattern over the first conductive chip guard pattern. The semiconductor device additionally includes a buffer layer between the first and second conductive chip guard patterns.