Build Plane Induction Coil Inspection for AM Internal Flaw Detection

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Solution Overview

Problem

Current additive manufacturing (AM) methods lack effective in-situ monitoring techniques to detect internal flaws during the build process, leading to wasted time and material due to the inability to accurately identify and classify internal defects before the final structure is completed.

Innovation Solution

A non-destructive inspection system utilizing a build plane induction coil sensor with coplanar magnetization and sensor coils, coupled with complex impedance plane analysis, to monitor and analyze the impedance characteristics of AM build parts in real-time, allowing for the identification of anomalies and adjustments during the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional thermal imaging and visual monitoring are used for in-situ inspection, then the inspection system is simple and easy to implement, but internal flaws below the surface layers cannot be accurately detected

Engineering Contradiction:
Improvedetection accuracy of internal flawsVSAvoidcomplexity of inspection system
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent replaces traditional optical/thermal imaging systems with electromagnetic induction technology. The build plane induction coil sensor uses electromagnetic fields to detect internal flaws, substituting mechanical/optical inspection methods with electromagnetic-based detection that can penetrate surface layers and identify subsurface defects accurately.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces an electromagnetic field as an intermediary between the inspection system and the build part. The magnetization coil generates an electromagnetic field that penetrates the build material, and the build plane induction coil sensor detects changes in this field caused by internal flaws, enabling indirect detection of subsurface defects.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If in-situ monitoring is implemented using traditional methods, then real-time inspection during build process is achieved, but internal flaws cannot be identified leading to wasted time and material

Engineering Contradiction:
Improvequality control effectivenessVSAvoidtime wasted completing builds with internal flaws
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent performs preliminary detection of internal flaws during the build process itself, before the build is completed. The build plane induction coil sensor continuously monitors for anomalies as each layer is deposited, enabling early detection of defects that would otherwise remain hidden until final inspection, thus preventing waste of time and material on flawed builds.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements a feedback mechanism where impedance data from the build plane induction coil sensor is analyzed in real-time by a processing system. When anomalies are detected, the system can provide feedback to adjust the build process or alert operators, enabling continuous quality control and preventing progression of flawed builds.

Inventive Principle:
Principle #23Feedback

3Measurement precision

If layer-by-layer inspection is performed using conventional techniques, then surface quality can be monitored, but internal flaws within bulk material remain undetected

Engineering Contradiction:
Improvedetection capability for internal flawsVSAvoiddifficulty of detecting subsurface defects
Core Design Contradiction:
Measurement precisionVSDifficulty of detecting and measuring

Solution Approach 1:

The patent replaces surface-level optical/thermal inspection methods with electromagnetic induction technology that can penetrate through material. The build plane induction coil sensor uses electromagnetic fields to detect internal flaws within the bulk material, overcoming the limitation of surface-only detection methods.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the detection parameter from optical/thermal surface properties to electromagnetic impedance characteristics. By measuring changes in electrical impedance caused by internal flaws affecting electromagnetic field distribution, the system can detect subsurface defects that are invisible to traditional surface inspection methods.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate in-situ detection of internal flaws and anomalies, facilitating real-time process adjustments and improving the quality control of AM parts by providing a closed-loop control mechanism for additive manufacturing processes.

Implementation Method 1

The magnetization coil is configured to induce currents within the build part

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

the sensor coil is configured to capture impedance data from the build part

Methodology Applied
Scientific EffectElectromagnetic field detection: Electromagnetic Induction

Data Source

PatentUS11565324B2System and method for in-situ inspection of additive manufacturing materials and builds
Publication Date: 2023.01.31 HUNTINGTON INGALLS INC
  • US11565324B2 patent drawing
  • US11565324B2 patent drawing
  • US11565324B2 patent drawing

AI summary

An inspection system for in situ evaluation of an additive manufacturing (AM) build part is provided. The inspection system comprises a build plane induction coil sensor configured and positionable so that during construction of the build part, the sensor's magnetization and sensor coils surround at least the last-produced layer of the AM build part in the build plane. The inspection system further comprises an energization circuit and a central processing system. The central processing system comprises a communication processor configured for sending command signals to the energization circuit and receiving impedance data from the build plane induction coil sensor, and energization controller configured for determining energization commands for transmission to the energization circuit, and an induction data analyzer configured for processing build part impedance data using complex impedance plane analysis and for identifying anomalies in the AM build part.