Build-Up Wiring Substrate Without Power-Feeding Layer for Short-Circuit Checks
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Solution Overview
Problem
Existing build-up wiring substrates face challenges in efficiently performing short-circuit checks during manufacturing, leading to potential defects and reduced quality.
Innovation Solution
A wiring substrate design featuring a build-up part with conductor layers and insulating layers, including a solder resist layer and metal posts protruding from it, allows for early detection of short-circuits by forming conductor layers without using a separate power feeding layer, and facilitates stable component mounting with metal posts that minimize short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate power feeding layer is used in build-up wiring substrates, then short-circuit checks cannot be performed efficiently during manufacturing, but removing it simplifies the structure and enables early defect detection
Solution Approach 1:
The invention removes the separate power feeding layer from the build-up wiring substrate structure. By extracting this unnecessary layer, the patent enables direct short-circuit checks between the solder resist layer and conductor layers during manufacturing, eliminating a source of potential defects while simplifying the overall layer structure.
2Reliability
If conventional mounting structures are used, then component mounting stability is reduced and short circuits increase, but metal posts provide stable connections and minimize short circuits
Solution Approach 1:
The invention forms metal posts that protrude from the solder resist layer before component mounting. This preliminary action creates pre-positioned, stable connection points that guide component placement and ensure reliable electrical connections, minimizing short circuits while maintaining manufacturing feasibility through standard plating processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient short-circuit checks during manufacturing, ensuring higher quality substrates with stable component connections and reduced defects, while allowing for high-density wiring patterns.
Implementation Method 1
the base plating layer includes a penetrating portion formed in an opening of the solder resist layer
Implementation Method 2
the base plating layer connected to the conductor pad of the conductor layer in the build-up part
Data Source
AI summary
A wiring substrate includes a build-up part including a conductor layer and an insulating layer, a solder resist layer formed in contact with a surface of the build-up part, and a metal post formed on the build-up part and protruding from the solder resist layer. The build-up part includes conductor layers including the conductor layer and insulating layers including the insulating layer such that the conductor layer includes a conductor pad, is formed on a surface of the solder resist layer and is in contact with a surface of the insulating layer forming the surface of the build-up part, and the metal post includes a base plating layer connected to the conductor pad of the conductor layer in the build-up part such that the base plating layer includes a penetrating portion formed in an opening of the solder resist layer and a pad portion protruding from the solder resist layer.