Building Platform Chip for Low-Latency Digital Twin Construction
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Solution Overview
Problem
Existing building management systems lack efficient methods for constructing and managing digital twins of building devices, leading to inefficiencies in data processing and latency issues.
Innovation Solution
Integration of a building platform chip within building devices to retrieve and generate data for constructing digital twins, establishing communication links with processing circuits and platforms to create a digital representation of building entities and relationships.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If building management systems use centralized data processing for digital twins, then data processing completeness is improved, but latency and computing power requirements increase
Solution Approach 1:
The patent segments the digital twin construction process by distributing data processing functions across multiple building devices rather than using centralized processing. Each building device with an integrated platform chip independently retrieves its own data and constructs its digital twin, eliminating the need for all devices to wait for centralized processing while maintaining complete local data processing.
2Loss of information
If building management systems use centralized data processing for digital twins, then data processing completeness is improved, but computing power requirements increase
Solution Approach 1:
The patent divides the computing workload by enabling each building device to independently process its own data locally through integrated platform chips. This segmentation eliminates the need for a centralized high-power processing system, as each device only needs to process its own relatively small dataset, significantly reducing overall computing power requirements while maintaining complete data processing.
3Productivity
If building management systems integrate platform chips in all building devices, then digital twin construction efficiency is improved, but device complexity increases
Solution Approach 1:
The patent implements a universal platform chip that can be integrated into any building device to provide digital twin construction capabilities. This multi-functional approach allows the same chip architecture to serve different device types (HVAC, lighting, security, etc.), standardizing the complexity rather than increasing it, while enabling efficient digital twin construction across the entire building ecosystem.
Data Source
AI summary
A method can include activating a building platform chip integrated into a building device of a building and coupled with a processing circuit of the building device. The method can include retrieving, by the building platform chip, first data from the processing circuit of the building device through communication with the processing circuit. The method can include generating, by the building platform chip, second data to cause a digital twin of the building device to be constructed.