Building Panel with Polymer Spacer Adhesive for Thermal Insulation

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Solution Overview

Problem

Existing building insulation systems with low thermal conductivity, such as those using vacuum panels, nanofoams, or gas-filled composites, lack load-carrying capability and stiffness due to mechanical weaknesses, and adhesives with high modulus of elasticity fail to maintain structural integrity over varying temperatures.

Innovation Solution

A composite building panel structure featuring external and inner plates connected by a solid structural adhesive with a polymer-based profile and spacers, utilizing thermally insulating materials like vacuum panels, gas-filled panels, or aerogels, and adhesives with specific hardness and elasticity to provide stiffness and inhibit heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If low thermal conductivity insulation materials (vacuum panels, nanofoams, aerogels) are used, then thermal insulation performance is improved, but load-carrying capability and stiffness deteriorate

Engineering Contradiction:
Improvethermal insulation performanceVSAvoidload-carrying capability
Core Design Contradiction:
Loss of energyVSStrength

Solution Approach 1:

The panel is divided into three functional segments: external plate, insulation core, and inner plate. Each segment performs a specific function - the plates provide structural strength while the insulation core provides thermal insulation, resolving the contradiction by separating structural and insulating functions into distinct components.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The panel uses a composite structure combining rigid plates (providing strength) with lightweight insulation materials (providing thermal isolation). The side frame acts as a composite element linking the plates mechanically while the insulation core provides thermal performance without compromising structural integrity.

Inventive Principle:
Principle #40Composite materials

2Strength

If soft polymer adhesives with low modulus of elasticity are used, then panel stiffness is improved, but adhesive strength deteriorates

Engineering Contradiction:
Improvepanel stiffnessVSAvoidadhesive strength
Core Design Contradiction:
StrengthVSForce

Solution Approach 1:

The adhesive layer is designed with specific local properties - soft polymer base providing flexibility and strength, modified with additives to achieve optimal modulus of elasticity (10-100 MPa). This localized optimization allows the adhesive to maintain both strength and appropriate stiffness characteristics.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The adhesive's physical parameters are specifically controlled - modulus of elasticity adjusted to 10-100 MPa range, hardness 20-40 Shore A, and thickness 1-5 mm. These parameter changes enable the adhesive to simultaneously provide sufficient strength and flexibility for thermal expansion accommodation.

Inventive Principle:
Principle #35Parameter changes

3Force

If rigid adhesives with high modulus of elasticity are used, then adhesive strength is improved, but ability to accommodate thermal expansion deteriorates

Engineering Contradiction:
Improveadhesive strengthVSAvoidthermal expansion accommodation
Core Design Contradiction:
ForceVSAdaptability or versatility

Solution Approach 1:

The adhesive's modulus of elasticity is specifically reduced to 10-100 MPa range through polymer selection and formulation. This parameter change enables the adhesive to flexibly accommodate thermal expansion and contraction of the panel while maintaining sufficient bonding strength.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The adhesive is formulated as a composite material - soft polymer base (providing flexibility) combined with reinforcing additives (providing strength). This composite approach allows simultaneous achievement of low modulus for thermal adaptation and sufficient tensile strength for structural integrity.

Inventive Principle:
Principle #40Composite materials

4Loss of energy

If thick adhesive layers are used, then thermal insulation is improved, but structural integrity deteriorates

Engineering Contradiction:
Improvethermal insulationVSAvoidstructural integrity
Core Design Contradiction:
Loss of energyVSStrength

Solution Approach 1:

The adhesive layer thickness is optimized to 1-5 mm through parameter adjustment. This moderate thickness provides sufficient thermal insulation while maintaining structural integrity - thick enough for insulation but thin enough to preserve bonding strength and panel rigidity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves enhanced stiffness and thermal insulation while maintaining structural integrity over temperature variations, effectively reducing energy consumption and extending the lifespan of building panels.

Implementation Method 1

adhesives with specific hardness and elasticity to provide stiffness and inhibit heat transfer

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

provide for dilatation of panels due to temperature difference within buildings

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 3

intermediate insulation space with any kind of thermal and/or sound insulation

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentEP2464799B1Building panel as structure of external and inner plate with intermediate insulation space
Publication Date: 2020.05.06 UNIVERSITY OF LJUBLJANA
  • EP2464799B1 patent drawingFigure 1
  • EP2464799B1 patent drawingFigure 2

AI summary

The building panel is structure of external (11) and inner (12) plate where there is intermediate insulation space between the plates (11) and (12). In this space there can by any kind of thermal and/or sound insulation which does preferably not form solid structure in connection with plates (11) and (12). The connection (1) forms connection between plates (11) and (12). The connection (1) is implemented at least along the longitudinal part of panel frame. Further the connection (1) comprises the attached polymer based profile (2) or stack of spacers (7).