Building Panel Sub Layer for Deep Embossing
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Solution Overview
Problem
Conventional wood fibre based building panels with thin surface layers, such as laminate flooring, face limitations in achieving deep embossing and sufficient impact resistance while maintaining cost-effectiveness, as existing methods require increased pressure and additional materials, which are costly and often result in inferior surface properties.
Innovation Solution
A method involving a sub layer of small wood fibres and an uncured binder applied between the surface layer and the core, allowing for deep embossing and improved impact resistance without damaging the surface layer, using a pressing process that distributes uniform counter pressure and can be cured with standard pressing conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If increased pressure and pressing time are used to achieve deep embossing, then embossing depth is improved, but production cost increases and surface layer may be damaged
Solution Approach 1:
A cushioning layer comprising uncured binder and filler particles is introduced between the surface layer and the core. This intermediary layer absorbs and distributes the pressing force, enabling deep embossing to be formed in the surface layer without requiring excessive pressing pressure that would damage the layer or increase production costs. The cushioning layer acts as a mediator that facilitates force distribution while protecting the surface layer integrity.
2Shape
If increased pressure is applied to form deep embossing, then embossing depth is improved, but the surface layer may be damaged
Solution Approach 1:
The cushioning layer is applied beforehand to the core surface before the surface layer is placed. This pre-applied cushioning layer softens and distributes the pressing force during the embossing process, preventing concentration of stress that would damage the surface layer. The uncured binder and filler particles provide a compliant interface that protects the surface layer while allowing deep embossing formation.
3Shape
If additional core paper sheets are added to achieve deeper embossing, then embossing depth is improved, but device complexity and production cost increase
Solution Approach 1:
Instead of adding multiple layers throughout the entire panel structure, the invention applies a localized cushioning layer only at the interface where embossing is required. This cushioning layer comprises uncured binder and filler particles that provide the necessary compliance for deep embossing formation. This approach achieves the desired embossing depth without increasing the overall number of layers or structural complexity of the panel.
4Ease of manufacture
If conventional pressing force is used, then production cost is maintained, but embossing depth is insufficient
Solution Approach 1:
The invention changes the physical parameters of the interface between the surface layer and core by introducing a cushioning layer with uncured binder and filler particles. This layer has different mechanical properties (softer, more compliant) than conventional solid core paper sheets. By changing this parameter, the system enables deep embossing formation using standard pressing forces, maintaining production cost while achieving the desired embossing depth.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of panels with deep embossing and enhanced impact resistance at a lower cost, using standard pressing forces and times, while maintaining the quality and design of the surface layer, and can be applied to various core materials, including those with uneven surfaces.
Implementation Method 1
bringing the core, the surface layer, the wood fibres and the uncured binder under increased pressure and temperature and forming them to a floor board by curing the binder
Implementation Method 2
The uncured sub layer behaves similar to a paste or a liquid substance and creates a uniform counter pressure in all parts under the surface layer even in surface parts with deep and sharp embossing
Implementation Method 3
The uncured sub layer behaves similar to a paste or a liquid substance and creates a uniform counter pressure in all parts under the surface layer even in surface parts with deep and sharp embossing
Data Source
Figure 1a~1d
Figure 2a~2e
Figure 3a~3d
AI summary
Building panels with a thin and embossed surface layer and a sub layer between a surface layer and a core.