Buildup RFID Antenna Embedding Chip in Dielectric
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Solution Overview
Problem
Conventional RFID tag antennas are sensitive to external impacts, static electricity, temperature, pressure, and humidity, leading to high defective rates and limited usage, especially when positioned within metals or liquids.
Innovation Solution
An antenna with a buildup structure where the tag chip is embedded within a dielectric layer, using a stacked configuration of dielectrics and a conductor-filled via-hole to connect the chip's input/output terminals to the radiator, ensuring protection from external factors and enabling operation within metals or liquids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the tag chip protrudes from the antenna structure, then the connection between chip and antenna is simple, but the chip becomes sensitive to external impacts, static electricity, temperature, pressure, and humidity
Solution Approach 1:
The tag chip is embedded within the dielectric layer, nesting the chip inside the antenna structure rather than having it protrude. This embedding protects the chip from external environmental factors while maintaining electrical connection through conductive patterns formed within the dielectric material.
Solution Approach 2:
The dielectric layer acts as a protective shell enclosing the tag chip. This thin film structure provides mechanical protection and environmental isolation while allowing the chip to function internally without direct exposure to external stresses.
2Ease of manufacture
If the tag chip protrudes from the antenna structure, then the manufacturing process is simpler, but the defective rate increases and recognition rate decreases
Solution Approach 1:
The tag chip is positioned and embedded within the dielectric layer during the manufacturing process before final assembly. This preliminary placement ensures proper alignment and connection, reducing defects caused by misalignment or damage that would occur with post-assembly attachment of protruding chips.
Solution Approach 2:
The chip embedding process merges the chip placement with the dielectric layer formation steps. By combining these operations, the patent reduces the number of separate manufacturing steps while ensuring precise chip positioning and connection, thereby reducing defective rates.
3Device complexity
If the tag chip protrudes from the antenna structure, then the structure is simpler, but the antenna cannot be used for positioning within metal or liquid environments
Solution Approach 1:
The dielectric layer serves as a protective shell that isolates the tag chip from corrosive or conductive environments such as liquids and metals. This encapsulation enables the antenna to function reliably in previously unusable environments while maintaining a relatively simple overall structure.
Solution Approach 2:
The dielectric material acts as an intermediary barrier between the tag chip and the external environment (metal or liquid). This intermediate layer prevents direct interaction between the chip and harmful environmental factors, enabling versatile deployment across different application scenarios.
Data Source
AI summary
There are provided an antenna using a buildup structure and a method of manufacturing the same. In the antenna, a tag chip is positioned within a dielectric and is connected to a radiator through a connection line or a via-hole, thereby being strong against external environments, decreasing a defective rate and enabling to be used for the special purpose of being positioned within a metal or liquid.