Built-in Electronic Component Substrate Thickness Reduction
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Solution Overview
Problem
The existing built-in electronic component substrates face challenges in reducing thickness due to the requirement of a sufficient space between the semiconductor chip and the second substrate for resin fillability, which can lead to voids and reliability issues if the space becomes too narrow.
Innovation Solution
A built-in electronic component substrate design that includes a first substrate with an electronic component, a first resin covering the component's side surfaces, a second substrate layered on top with a substrate connection member, a second resin filling between the component and the second substrate, and a third resin encapsulating the connection member, component, and resins, allowing for reduced thickness without compromising resin fillability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the space between the back surface of the semiconductor chip and the second substrate is reduced to decrease substrate thickness, then the substrate thickness is reduced, but resin cannot sufficiently fill the space causing voids and reliability degradation
Solution Approach 1:
The resin filling process is segmented into multiple stages: first resin fills the space between the semiconductor chip and second substrate, then second resin fills the remaining spaces. This segmentation allows resin to progressively occupy narrow spaces without forming voids, enabling reduced substrate thickness while maintaining reliability.
Solution Approach 2:
The first resin is supplied in advance to fill the narrow space between the semiconductor chip and second substrate before the second resin is supplied. This preliminary action ensures that the narrowest spaces are filled first, preventing void formation and enabling thinner substrate design.
2Length of stationary object
If the space between the back surface of the semiconductor chip and the second substrate is reduced, then the substrate thickness is reduced, but voids are generated due to insufficient resin filling
Solution Approach 1:
The resin filling is divided into two sequential processes: first resin fills the critical narrow space between the semiconductor chip and second substrate, then second resin fills remaining spaces. This segmentation eliminates void formation by ensuring complete filling of narrow spaces before proceeding to other areas.
Solution Approach 2:
The first resin is supplied in advance to occupy the narrow space between the semiconductor chip and second substrate, preventing void formation in this critical region. This preliminary filling action enables reduced substrate thickness without generating harmful voids.
3Length of stationary object
If the space between the back surface of the semiconductor chip and the second substrate is reduced, then the substrate thickness is reduced, but resin encapsulation becomes insufficient
Solution Approach 1:
The resin encapsulation process is segmented into multiple resin supply steps: first resin provides initial encapsulation of the semiconductor chip, then second resin completes the encapsulation. This segmentation ensures stable and complete resin coverage even when the substrate thickness is reduced.
Solution Approach 2:
The first resin is supplied in advance to establish initial encapsulation of the semiconductor chip and fill the narrow space. This preliminary encapsulation action maintains structural stability and prevents resin deficiency, enabling thinner substrate design with adequate encapsulation.
Data Source
AI summary
A built-in electronic component substrate includes a first substrate, an electronic component including side surfaces and mounted on the first substrate, a first resin provided on the first substrate and covering the side surfaces of the electronic component, a second substrate provided above the electronic component and the first resin and layered on the first substrate, a substrate connection member provided between the first and the second substrates and electrically connecting the first and the second substrates, a second resin filling in between the electronic component and the second substrate and in between the first resin and the second substrate, and a third resin filling in between the first and the second substrates and encapsulating the substrate connection member, the electronic component, the first resin, and the second resin.