Built-in Thermoelectric Cooler for Microelectronic Assembly
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Solution Overview
Problem
Current thermoelectric coolers (TECs) for microelectronic devices are limited by their inability to accommodate specific heat removal requirements, are constrained by their thickness, and suffer from increased thermal contact resistance due to mounting materials, which compromises heat removal efficiency.
Innovation Solution
A microelectronic assembly with a built-in thermoelectric cooler (TEC) is fabricated, eliminating the need for mounting materials by integrating the TEC directly onto the device, using a structure with N-type and P-type electrodes made from Bi or Te-based alloys, and a patterned oxide layer for electrical isolation, connected via interconnect metallization elements, and coupled with a feedback control loop for optimal temperature management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If TEC is mounted to microelectronic device using mounting materials (thermal grease, epoxy, solder), then TEC can be attached to device, but thermal contact resistance increases and heat removal efficiency decreases
Solution Approach 1:
The TEC is integrated directly into the microelectronic device structure, merging the cooling component with the device substrate. This eliminates the interface between TEC and device that would otherwise require mounting materials, thereby eliminating thermal contact resistance and improving heat removal efficiency.
Solution Approach 2:
The mounting materials (thermal grease, epoxy, solder) are completely removed from the system. By extracting these intermediary substances, the patent eliminates the source of thermal contact resistance while maintaining the functional connection between TEC and microelectronic device through direct integration.
2Power
If TEC thickness is increased to improve heat removal capability, then heat flux capacity improves, but device size and complexity increase
Solution Approach 1:
The TEC is integrated at the specific location where heat removal is most critical - directly at the heat-generating region of the microelectronic device. This localized integration allows for effective heat removal with minimal TEC thickness, avoiding the need for thick TEC structures that would increase device complexity.
3Adaptability or versatility
If conventional TEC design is used, then manufacturing process is established, but TEC cannot accommodate specific heat removal requirements of particular microelectronic devices
Solution Approach 1:
The TEC is divided into multiple independent thermoelectric couples that can be selectively activated. This segmentation allows the system to accommodate specific heat removal requirements by enabling or disabling particular couples based on the thermal map and cooling needs of the microelectronic device, while maintaining a standardized manufacturing process for the overall TEC structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces thermal contact resistance, allowing for greater temperature reduction at hot spots and lower power input, enhancing cooling efficiency compared to conventional TECs.
Implementation Method 1
TEC's function based on the Peltier effect, according to which the passage of an electrical current through a junction including two dissimilar materials results in a cooling effect
Data Source
AI summary
A method for fabricating a microelectronic assembly including a built-in TEC, a microelectronic assembly including a built-in TEC, and a system including the microelectronic assembly. The method includes providing a microelectronic device, and fabricating the TEC directly onto the microelectronic device such that there is no mounting material between the TEC and the microelectronic device.