Lateral Bulk Acoustic Wave Resonator Heat Dissipation Structure
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Solution Overview
Problem
Laterally excited bulk acoustic wave resonators face challenges with heat dissipation and mechanical ruggedness, especially in high-frequency applications like 5G NR, where power durability and thermal management are critical but often compromised by the need for expensive acoustic Bragg reflectors.
Innovation Solution
Incorporating a thermally conductive layer with high thermal conductivity, such as aluminum or silicon, between the piezoelectric layer and the support substrate, or as an air cavity, to enhance heat dissipation and mechanical durability while maintaining resonant frequency performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If acoustic Bragg reflectors are used to improve heat dissipation and mechanical ruggedness, then thermal management and power durability are enhanced, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts the heat dissipation function from the complex acoustic Bragg reflector structure and implements it through a simplified support substrate with integrated thermal conduction pathways. The support substrate directly conducts heat away from the piezoelectric layer without requiring additional Bragg reflector layers, thereby maintaining power durability while reducing structural complexity.
Solution Approach 2:
The support substrate is designed to serve multiple functions simultaneously: providing mechanical support, enabling heat dissipation through thermal conduction, and eliminating the need for separate acoustic Bragg reflectors. This multi-functionality approach enhances power durability while avoiding the increased complexity that would result from adding dedicated heat dissipation structures.
2Temperature
If acoustic Bragg reflectors are used to enhance heat dissipation, then thermal management is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the heat dissipation function with the support substrate structure, eliminating the need for separate acoustic Bragg reflector components. By integrating thermal conduction pathways into the existing support substrate, the design achieves effective heat dissipation while reducing the number of manufacturing steps and material requirements, thereby lowering overall manufacturing cost.
Solution Approach 2:
The patent employs standard, cost-effective materials for the support substrate that provide sufficient thermal conduction without requiring expensive specialized materials. The design uses readily available materials with adequate thermal properties, avoiding the high costs associated with complex acoustic Bragg reflector implementations while maintaining effective heat dissipation.
3Device complexity
If the piezoelectric layer is directly supported without thermal management, then device complexity is reduced, but heat dissipation and power durability deteriorate
Solution Approach 1:
The patent introduces thermal conduction pathways as intermediaries between the piezoelectric layer and the support substrate. These pathways efficiently transfer heat away from the piezoelectric layer without adding significant structural complexity, thereby maintaining power durability and effective heat dissipation while preserving the simplicity of the overall device design.
4Temperature
If high thermal conductivity materials are used in the piezoelectric layer, then heat dissipation is improved, but resonant frequency performance may be affected
Solution Approach 1:
The patent segments the thermal management function from the piezoelectric layer by implementing thermal conduction pathways in the support substrate rather than modifying the piezoelectric layer itself. This segmentation allows the piezoelectric layer to maintain its optimized resonant frequency characteristics while the support substrate handles thermal dissipation, avoiding any potential impact on resonant frequency performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective thermal dissipation and power durability for high-frequency applications, reducing costs by avoiding the need for expensive acoustic Bragg reflectors and improving the performance of acoustic wave filters in 5G NR and other high-frequency bands.
Implementation Method 1
a thermally conductive layer arranged at least partially in contact with the piezoelectric layer
Data Source
AI summary
An acoustic wave device is disclosed. The acoustic wave deice can include a membrane structure and a support substrate. The membrane structure includes a piezoelectric layer, an interdigital transducer electrode arranged on the piezoelectric layer, and a thermally conductive layer arranged at least partially in contact with the piezoelectric layer. The support substrate is connected to the membrane structure and configured such that a cavity is provided next to the membrane structure. The acoustic wave device can laterally excite a bulk acoustic wave.