Bulk Connector Package Layout for Low-Ohmic Cooling Paths
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Solution Overview
Problem
Existing electronic packages face reliability and performance issues due to overheating during operation, particularly in high current power applications, where conventional packaging solutions fail to effectively manage thermal and electric connectivity.
Innovation Solution
A package design featuring a carrier with electronic components encapsulated by an insulating material, a clip connected to the components, and a bulk connector mounted vertically above the components, providing a compact, low-ohmic path for electrical connection and enhanced thermal management through a cooling structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging solutions are used, then device complexity is reduced, but overheating occurs during operation reducing reliability and performance
Solution Approach 1:
The patent merges the electrical connection function and thermal management function into a single integrated bulk connector structure. The bulk connector simultaneously provides low-ohmic electrical connectivity and acts as a heat sink with integrated cooling channels, eliminating the need for separate thermal management components and reducing overall package complexity while improving thermal reliability.
Solution Approach 2:
The bulk connector is designed to perform multiple functions: it serves as an electrical connector for low-ohmic connections, as a heat sink for thermal management, and as a structural support element. This multi-functionality allows a single component to address both electrical connectivity and thermal management requirements, resolving the contradiction between reliability and complexity.
2Loss of energy
If conventional electrical connections are used, then device complexity is minimized, but ohmic losses increase causing overheating
Solution Approach 1:
The patent combines the electrical conduction path and thermal conduction path into a single bulk connector structure. The bulk connector provides direct low-ohmic electrical connection while simultaneously conducting heat away from the electronic components, thereby reducing ohmic losses and preventing overheating without requiring complex multi-component assemblies.
Solution Approach 2:
The bulk connector is made from electrically and thermally conductive materials that provide both low electrical resistance for minimal ohmic losses and high thermal conductivity for effective heat dissipation. This use of composite or multi-functional materials allows a single structure to address both energy loss and thermal management issues.
3Productivity
If electronic components are densely packaged, then productivity is improved, but thermal management becomes difficult leading to overheating
Solution Approach 1:
The patent transitions from planar thermal management to three-dimensional thermal management by placing the bulk connector vertically above the electronic components. This vertical arrangement allows heat to be conducted upward through the bulk connector in the Z-direction, enabling effective thermal management even when components are densely packed in the XY-plane, thus maintaining high productivity while controlling operating temperature.
Solution Approach 2:
The bulk connector integrates electrical connection and thermal management functions, allowing densely packaged components to benefit from both low-ohmic electrical connectivity and effective heat removal through the same structural element, enabling high packaging density without compromising thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces ohmic losses and prevents overheating, resulting in high electric and thermal reliability and performance, even in high current applications.
Implementation Method 1
an electrically conductive bulk connector which is electrically connected with and mounted on top of or above the electronic components
Implementation Method 2
enhanced thermal management through a cooling structure
Data Source
AI summary
A package which comprises a carrier, electronic components mounted on the carrier, an encapsulant at least partially encapsulating the carrier and the electronic components, a clip connected to upper main surfaces of the electronic components, and an electrically conductive bulk connector which is electrically connected with and mounted above the electronic components.