Composite-Substrate Bulk Acoustic Resonator for 5 GHz Heat Dissipation
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Solution Overview
Problem
Current bulk-acoustic wave resonators face manufacturing difficulties and performance degradation when attempting to implement a 5 GHz frequency band, and they struggle with heat dissipation, making it challenging to develop suitable filters for 5G communication modules.
Innovation Solution
A bulk-acoustic wave resonator design incorporating substrates with varying thickness ratios of silicon (Si) and silicon carbide (SiC) materials, where the thermal conductivity of the SiC substrate is higher than that of the Si substrate, to enhance heat dissipation and reduce frequency loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a bulk-acoustic wave resonator is designed for a 5 GHz frequency band, then the frequency band capability is improved, but manufacturing process difficulty increases and performance degrades
Solution Approach 1:
The patent changes the material parameter by substituting part of the silicon substrate with silicon carbide, which has different thermal and mechanical properties. This material substitution enables the resonator to operate at 5 GHz frequency band while maintaining manufacturability and performance, as silicon carbide provides better thermal conductivity and mechanical strength suitable for high-frequency operation
Solution Approach 2:
The patent employs a composite substrate structure combining silicon and silicon carbide materials. The silicon carbide portion is integrated into the silicon substrate to create a composite structure that leverages the advantages of both materials: silicon provides ease of manufacturing and integration, while silicon carbide enhances thermal management and mechanical properties for 5 GHz operation
2Adaptability or versatility
If a bulk-acoustic wave resonator operates at a 5 GHz frequency band, then the frequency band capability is improved, but heat generation increases
Solution Approach 1:
The patent uses a composite substrate combining silicon and silicon carbide, where the silicon carbide portion provides superior thermal conductivity to efficiently conduct away heat generated during 5 GHz operation, while maintaining the electrical and mechanical properties needed for high-frequency resonance
Solution Approach 2:
The silicon carbide portion acts as a thermal intermediary or heat sink within the substrate structure, providing a thermal conduction pathway that mediates the heat transfer from the active resonator region to the surrounding substrate, thereby managing temperature rise during high-frequency operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces frequency loss and improves heat dissipation characteristics, enabling the implementation of bulk-acoustic wave resonators suitable for 5 GHz frequency bands by optimizing the thickness ratios of the substrates.
Implementation Method 1
the second material has thermal conductivity that is higher than a thermal conductivity of the first material
Data Source
AI summary
A bulk-acoustic wave resonator includes: a first substrate formed of a first material; an insulating layer or a piezoelectric layer disposed on a first side of the first substrate; and a second substrate formed of a second material and disposed on a second side of the first substrate, wherein the second material has thermal conductivity that is higher than a thermal conductivity of the first material.