Bulk Substrate with Patterned Soft and Stiff Elastic Regions
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Solution Overview
Problem
Current stretchable electronics face limitations in flexibility due to the need for rigid form factors in multilayer structures, leading to interfacial issues when stiff substrates are laminated onto elastomeric bases, which restricts the stretchability of devices.
Innovation Solution
A method for fabricating bulk substrates with patterned soft and stiff elastic regions directly into the material, eliminating adhered interfaces and enabling multi-modulus behavior, allowing for spatial control of properties like Young's modulus and thermal expansion, thereby enhancing strain tolerance and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If stiff substrates are laminated onto elastomeric substrates to provide rigid form factor for electronic components, then the structural rigidity and stability of electronic components is improved, but interfacial issues arise and strain capacity is reduced
Solution Approach 1:
The substrate is designed with spatially varying mechanical properties, containing both stiff regions (with Young's modulus >10% of bulk modulus) that provide structural rigidity for electronic components and soft-elastic regions (with Young's modulus <10% of bulk modulus) that accommodate strain. This local differentiation allows different regions to serve different functions without creating harmful interfaces.
Solution Approach 2:
The invention uses a composite substrate structure combining stiff and soft-elastic regions within a single continuous material matrix. This eliminates the need for laminated interfaces between dissimilar materials, thereby removing interfacial issues while maintaining both rigidity and strain capacity.
2Shape
If geometric solutions like thin-film variations are used to accommodate smaller bending radii, then the flexibility of rigid structures is improved, but stretchability remains limited
Solution Approach 1:
The substrate incorporates localized soft-elastic regions that can undergo large deformations (greater than 25% strain) while stiff regions maintain their shape and provide structural support. This local quality differentiation enables the structure to achieve both small bending radii and high stretchability simultaneously.
3Adaptability or versatility
If multi-material lamination is used to create substrates with different mechanical properties, then the multi-modulus behavior is achieved, but interfacial issues manifest at intermediate and high strains
Solution Approach 1:
The invention merges the stiff and soft-elastic regions into a single continuous material system rather than using separate laminated layers. This integration eliminates interfaces between dissimilar materials, thereby maintaining multi-modulus behavior while preventing interfacial issues that would otherwise manifest at intermediate and high strains.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables stretchable electronic stacks to deform primarily in soft regions, maintaining device functionality despite mechanical limitations, and allows for the microfabrication of strain-intolerant components on stiff regions, improving the overall performance and flexibility of electronic devices.
Implementation Method 1
a bulk material that can exhibit multi-modulus behavior that is spatially-controlled either during the synthesis of the bulk material, or as a function of the post-polymerization modification of the bulk material
Data Source
AI summary
A bulk substrate for stretchable electronics. The bulk substrate is manufactured with a process that forms a soft-elastic region of the bulk substrate. The soft-elastic region includes a strain capacity of greater than or equal to 25% and a first Young's modulus below 10% of a maximum local modulus of the bulk substrate. The process also forms a stiff-elastic region of the bulk substrate. The stiff-elastic region includes a strain capacity of less than or equal to 5% and a second Young's modulus greater than 10% of the maximum local modulus of the bulk substrate.