Lateral Bulk Acoustic Wave Resonator With Acoustic Mirror Cooling

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Solution Overview

Problem

Existing laterally excited bulk acoustic wave resonators face challenges with heat dissipation and mechanical ruggedness, particularly in high-frequency applications, which can lead to power durability issues and acoustic energy leakage.

Innovation Solution

A laterally excited bulk acoustic wave device is designed with a solid acoustic mirror and a support substrate of high thermal conductivity, where the piezoelectric layer is bonded to the substrate, and an interdigital transducer electrode is used to excite bulk acoustic waves, effectively confining acoustic energy and enhancing heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a laterally excited bulk acoustic wave resonator is used for high-frequency applications, then the resonant frequency is improved, but heat dissipation deteriorates leading to power durability issues

Engineering Contradiction:
Improveresonant frequencyVSAvoidheat dissipation
Core Design Contradiction:
SpeedVSTemperature

Solution Approach 1:

A heat sink is introduced as an intermediary component between the piezoelectric layer and the external environment. The heat sink receives heat from the piezoelectric layer through thermal conduction and dissipates it to the surroundings, serving as a mediator that separates the heat generation source from the operational components, thereby improving power durability in high-frequency applications

Inventive Principle:
Principle #24Intermediary (Mediator)

2Speed

If a laterally excited bulk acoustic wave resonator is used, then high-frequency resonance is achieved, but acoustic energy leakage increases reducing reliability

Engineering Contradiction:
Improveresonant frequencyVSAvoidacoustic energy confinement
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The piezoelectric layer is extracted and bonded to a separate support substrate. This separation allows the piezoelectric layer to be optimized for high-frequency resonance while the support substrate provides mechanical stability and acoustic energy confinement, preventing leakage and improving reliability

Inventive Principle:
Principle #2Taking out (Extraction)

3Strength

If the piezoelectric layer is bonded to the substrate, then mechanical ruggedness is improved, but acoustic energy may leak into the substrate

Engineering Contradiction:
Improvemechanical ruggednessVSAvoidacoustic energy leakage
Core Design Contradiction:
StrengthVSLoss of energy

Solution Approach 1:

A heat sink is positioned between the piezoelectric layer and the substrate. This heat sink acts as an intermediary that provides thermal management while also serving as an acoustic barrier, preventing acoustic energy from leaking into the substrate while maintaining mechanical ruggedness through the bonded structure

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves mechanical ruggedness and thermal dissipation, allowing for high-frequency resonance with increased power durability and reduced acoustic energy leakage, making it suitable for applications like 5G NR and 4G LTE frequency bands.

Implementation Method 1

a solid acoustic mirror on the support substrate, a piezoelectric layer on the solid acoustic mirror... The solid acoustic mirror is arranged to confine acoustic energy such that the support substrate is free from acoustic energy during operation

Methodology Applied
Scientific EffectAcoustic reflection: Reflection

Implementation Method 2

the support substrate is arranged to increase heat dissipation of the laterally excited bulk acoustic wave device... heat associated with the bulk acoustic wave is arranged to flow through the solid acoustic mirror to the support substrate... the support substrate has a thermal conductivity that is higher than a thermal conductivity of the piezoelectric layer

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

an interdigital transducer electrode on the piezoelectric layer. The interdigital transducer electrode is arranged to laterally excite a bulk acoustic wave

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS11463065B2Laterally excited bulk wave device with acoustic mirror
Publication Date: 2022.10.04 SKYWORKS SOLUTIONS INC
  • US11463065B2 patent drawing
  • US11463065B2 patent drawing
  • US11463065B2 patent drawing

AI summary

A laterally excited bulk acoustic wave device is disclosed. The laterally excited bulk acoustic wave device can include a support substrate, a solid acoustic mirror on the support substrate, a piezoelectric layer on the solid acoustic mirror, and an interdigital transducer electrode on the piezoelectric layer. The interdigital transducer electrode is arranged to laterally excite a bulk acoustic wave.