Bulkhead-Mounted Optoelectronic Device Integration
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Solution Overview
Problem
Existing optoelectronic devices mounted to bulkheads in military vehicles are bulky, heavy, and complex, leading to inefficiencies in space utilization, weight reduction, reliability, and cost-effectiveness.
Innovation Solution
A compact optoelectronic device comprising a sleeve, optical subassembly, electrical connector, and substrate with electrical signal conditioning components, where the substrate is mounted perpendicular to the sleeve's longitudinal axis, integrating optical and electrical components for direct attachment to a bulkhead, eliminating the need for separate connectors and adapters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional separate components (optoelectronic device, bulkhead connector, optical fibers, connectors, and adapters) are used, then the system can achieve optical signal transmission, but the device becomes bulky, heavy, and complex with increased interior space requirements
Solution Approach 1:
The patent combines the optoelectronic device, bulkhead connector, and optical fiber assembly into a single integrated unit. The optoelectronic device is directly mounted to the bulkhead with the optical fiber extending from the device housing, eliminating the need for separate connectors and adapters. This merging of components directly reduces interior space requirements and simplifies the overall system architecture.
2Weight of moving object
If traditional separate components are used, then the system can transmit optical signals, but the weight increases due to multiple connectors, adapters, and lengths of optical fiber
Solution Approach 1:
The integration of the bulkhead connector and optoelectronic device into a single unit eliminates multiple connection points and reduces the total length of optical fiber required. This weight reduction is achieved by removing redundant components while maintaining signal transmission capability through the integrated design.
Solution Approach 2:
The patent extracts and eliminates unnecessary intermediate components (separate connectors and adapters) from the optical signal path. By removing these extraneous elements, the system achieves weight reduction without compromising reliability, as the integrated design provides fewer potential failure points.
3Reliability
If traditional separate components with multiple junctions are used, then the system can be assembled, but optical power losses increase and reliability decreases
Solution Approach 1:
The integrated design merges the bulkhead connector and optoelectronic device into a single unit with fewer internal junctions. This reduction in connection points minimizes optical power losses at interfaces while simultaneously improving reliability by eliminating potential failure points associated with multiple separate components and their interconnections.
4Ease of manufacture
If traditional separate components are used, then the system can be manufactured, but the manufacturing cost increases and installation complexity increases
Solution Approach 1:
The patent combines multiple components into a single integrated unit that can be manufactured as one assembly, reducing the need for separate manufacturing processes and quality control steps for each component. This integration simplifies the installation process to a single mounting operation rather than multiple assembly steps, thereby reducing installation time and complexity while potentially lowering overall manufacturing costs.
Data Source
AI summary
The optoelectronic device includes a sleeve, an optical subassembly, an electrical connector, and a substrate. The sleeve includes a longitudinal axis, and the sleeve is mountable to a bulkhead. The substrate forms a plane. The substrate is attached to the optical subassembly and to the electrical connector. The substrate includes electrical signal conditioning components mounted thereon. The electrical signal conditioning components electrically connect the optical subassembly to the electrical connector. The substrate is mounted to the sleeve, and the plane of the substrate is substantially perpendicular to the longitudinal axis of the sleeve.