Compliant Bullet Interconnect for Low-Inductance High-Current Mating

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Solution Overview

Problem

Existing interconnect solutions for high current applications face challenges in minimizing inductance while accommodating misalignment and high current transmission in physically constrained environments, often failing to meet all criteria of low inductance, high current capacity, and compliance with misalignment tolerance.

Innovation Solution

A three-piece interconnect system featuring a blindmate bullet connector with compliant center pins and shrouds, including spring fingers that deflect to maintain contact during misalignment, and a dielectric insulator to minimize inductance and maximize allowable misalignment, allowing for efficient high current transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a traditional rigid interconnect structure is used, then manufacturing precision can be maintained, but misalignment tolerance deteriorates

Engineering Contradiction:

Improveconnector alignment precisionVSAvoidmisalignment tolerance

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent applies dynamics by making the outer conductor flexible rather than rigid. The outer conductor is configured to deflect and accommodate misalignment between connectors while maintaining electrical contact, allowing the structure to adapt dynamically to positioning variations without requiring high manufacturing precision

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent uses a flexible outer conductor that can bend and deform to tolerate misalignment. This flexible shell structure allows the interconnect to adapt to dimensional variations and misalignment while maintaining reliable electrical connection, resolving the contradiction between manufacturing precision and misalignment tolerance

Inventive Principle:

Principle #30Flexible shells and thin films

2Loss of energy

If the gap between inner conductor and outer conductor is reduced, then inductance is minimized, but current capacity deteriorates

Engineering Contradiction:

ImproveinductanceVSAvoidcurrent capacity

Core Design Contradiction:

Loss of energyVSPower

Solution Approach 1:

The patent changes the physical parameters of the conductors by using larger cross-sectional areas for both the inner conductor and outer conductor. This parameter change allows the gap between conductors to be reduced (lowering inductance) while the increased conductor size maintains high current capacity, resolving the contradiction between energy loss and power handling

Inventive Principle:

Principle #35Parameter changes

3Adaptability or versatility

If spring fingers are added to accommodate misalignment, then misalignment tolerance is improved, but device complexity increases

Engineering Contradiction:

Improvemisalignment toleranceVSAvoidconnector structure complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent makes the outer conductor serve multiple functions: it provides electrical connection, acts as a shield, and simultaneously accommodates misalignment through its flexible nature. This multi-functionality reduces the need for separate alignment mechanisms, offsetting the added complexity with functional integration

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The flexible outer conductor structure provides misalignment tolerance through its ability to deflect, replacing the need for complex mechanical alignment mechanisms. This approach achieves adaptability with relatively simple structural modifications rather than adding multiple separate components

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The interconnect system effectively reduces inductance, enhances current capacity, and tolerates significant misalignment, making it suitable for high current transmission in constrained spaces with improved mechanical and electrical performance.

Implementation Method 1

spring fingers that deflect to maintain contact during misalignment

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS20240213696A1High current low inductance compliant interconnect system

Publication Date: 2024.06.27 RAYTHEON CO

AI summary

An interconnect including a first connector, a second connector, and a bullet connector. The first connector includes a first conductive, compliant conductive center pin and a first shroud. The second connector includes a second conductive, compliant center pin and a second shroud. The bullet includes first and second ends that couple, respectively, to the first and second connectors, an inner conductor, an outer conductor, and an electrically insulator layer disposed therebetween. The inner conductor includes a first compliant jack at the first end that is electrically coupled to a second compliant jack at the second end. Each compliant jack includes a plurality of center pin spring fingers configured to engage the respective compliant center pin of the respective first or second connector. The other conductor includes respective pluralities of body spring fingers at each end that are configured to engage, respectively, with the first and second shrouds.