Bump Array Slope Coefficients for Flexible Substrate Alignment
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Solution Overview
Problem
Flexible array substrates in electronic devices, such as LCD and OLED devices, experience misalignment issues due to size changes during manufacturing, leading to mismatch between bumps on driving integrated circuits and pads, affecting bonding reliability.
Innovation Solution
The electronic device features bumps arranged in specific configurations with varying slope coefficients and shift values, allowing them to tilt and adjust relative to a reference line, enabling flexible alignment with deformed substrates and improving bonding reliability by allowing movement along the reference line during substrate expansion or contraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If flexible array substrates are used to enable flexible display manufacturing, then ease of manufacture is improved, but manufacturing precision deteriorates due to size changes during processes causing misalignment between bumps and pads
Solution Approach 1:
The bump configuration is designed to be dynamic rather than static. The bumps are arranged with varying slope coefficients (βA and βB) that allow them to adapt their orientation and position relative to the substrate deformation. This dynamic arrangement enables the bumps to maintain proper alignment with pads even when the flexible substrate changes size during manufacturing processes.
Solution Approach 2:
The invention changes the geometric parameters of the bump arrangement by introducing different slope coefficients (βA and βB) for adjacent bumps. These parameter variations allow the bump centers to follow different axial coordinate relationships (XA(1+βAAYA) and XB(1+βBYB)), enabling the bump array to accommodate substrate size changes while maintaining alignment precision.
2Ease of manufacture
If fixed bump configurations are used for simple manufacturing, then ease of manufacture is improved, but reliability deteriorates due to misalignment with deformed substrates
Solution Approach 1:
Different bumps are assigned different local properties through varying slope coefficients. Each bump has its own specific βA and βB values that are optimized for its local position in the array. This local quality differentiation allows each bump to independently adapt to substrate deformation, maintaining bonding reliability across the entire array while keeping the manufacturing process relatively simple.
3Device complexity
If uniform slope coefficients are applied to all bumps for simplicity, then device complexity is reduced, but adaptability deteriorates as bumps cannot respond to substrate expansion or contraction
Solution Approach 1:
The bump array is segmented into individual units, each with its own slope coefficient characteristics. Rather than treating the bump array as a uniform whole, the invention divides it into discrete bumps (with at least first and second bumps having different coefficients) that can independently respond to substrate deformation. This segmentation enables adaptability while keeping each individual bump relatively simple in structure.
Data Source
AI summary
An electronic device includes a substrate and first bumps. The first bumps are disposed on the substrate and arranged in a first bump row. Each first bump has a first end and a second end opposite to each other. Centers of the first ends of the first bumps are on a first axial line. A first axial coordinate of a center of the second end of a respective first bump relative to a second axial line perpendicular to the first axial line is XA(1+βAYA), in which XA is a first axial coordinate of the center of the first end of the respective first bump relative to the second axial line, YA is a second axial coordinate of the center of the second end of the respective first bump relative to the first axial line, and βA is a slope coefficient of the respective first bump.