Bump Chip Carrier Package with Lead Frame Circuit Sockets
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Solution Overview
Problem
Current integrated circuit packaging technologies face challenges in achieving lower package profiles while supporting high pin counts and improved electrical and thermal performance for consumer electronics.
Innovation Solution
A bump chip carrier semiconductor package system is developed, featuring a lead frame with circuit sockets, a semiconductor die with electrical interconnects, and a molding compound that encapsulates the die and interconnects, allowing for lower profiles and increased pin counts through flip chip mounting and lead frame interconnects that redistribute electrical signals and provide thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional packaging methods are used, then package height is reduced, but pin count support and electrical performance deteriorate
Solution Approach 1:
The patent transitions from planar lead frame interconnects to three-dimensional vertical interconnects through circuit sockets that extend downward from the lead frame surface. This dimensional change allows electrical signals to be transmitted vertically through the package structure, enabling high pin count support while maintaining low package profile through efficient space utilization in the vertical dimension.
Solution Approach 2:
The circuit sockets are nested within the lead frame structure, with socket bodies extending into the lead frame substrate. This nesting approach allows the interconnect structure to be integrated within the existing package footprint rather than adding external components, thereby reducing overall package height while supporting high pin counts through the nested socket architecture.
2Adaptability or versatility
If more functions are packed into integrated circuit, then pin count increases, but package complexity and cost increase
Solution Approach 1:
The circuit sockets serve multiple functions: they provide electrical interconnection, mechanical support for the semiconductor die, and thermal management pathways. This multi-functionality allows the package to support high pin counts and increased functionality without proportionally increasing complexity, as the same structural elements fulfill multiple roles in the package system.
Solution Approach 2:
The patent merges the interconnection function with the structural support function by integrating the circuit sockets directly into the lead frame. This consolidation eliminates the need for separate substrate layers and intermediate interconnect structures, reducing package complexity while enabling high pin count support through the unified socket-integrated lead frame design.
3Ease of manufacture
If lead frame interconnects are used, then manufacturing cost is reduced, but electrical performance may deteriorate
Solution Approach 1:
The circuit sockets are designed with optimized geometric parameters including socket depth, width, and wall thickness to achieve low inductance and capacitance values. By carefully controlling these dimensional parameters, the lead frame interconnects achieve electrical performance comparable to or better than traditional substrate-based interconnects, while maintaining the cost advantages of lead frame manufacturing processes.
Data Source
AI summary
A bump chip carrier semiconductor package system is provided including providing a lead frame, forming circuit sockets in the lead frame, mounting a semiconductor die on the lead frame, wherein the semiconductor die have electrical interconnects that connects to the circuit sockets, and encapsulating a molding compound to cover the semiconductor die and the electrical interconnects.