Double-Sided Semiconductor Module With Bump-Clip Thermal Assembly
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Solution Overview
Problem
Semiconductor modules with double-sided heat dissipation structures face challenges due to misalignment and poor adhesion issues when using spacers, leading to reduced yield and inefficiencies in heat dissipation.
Innovation Solution
A semiconductor module design that eliminates the need for spacers by using bumps to electrically connect semiconductor devices to a circuit board and conductive clips to connect devices to heat dissipation substrates, allowing for direct surface contact and improved heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If spacers are used to compensate for thickness deviation and form injection spaces, then the gap between heat dissipation substrates can be secured, but misalignment occurs and adhesion deteriorates due to height deviation
Solution Approach 1:
The patent removes spacers from the semiconductor module structure entirely. Instead of using spacers to secure gaps and form injection spaces, the design relies on the bonding pads and molding compound to achieve these functions, thereby eliminating the alignment and adhesion problems associated with spacer height deviations
Solution Approach 2:
The patent combines multiple functions into fewer components. The bonding pads serve both electrical connection and mechanical support functions, while the molding compound simultaneously provides structural support, electrical insulation, and thermal management, replacing the separate spacer component
2Ease of manufacture
If spacers are used for thickness compensation and electrical connection, then the structure can be assembled, but the number of bonding processes increases reducing yield
Solution Approach 1:
The patent merges the electrical connection function and mechanical support function into a single bonding pad structure, eliminating the need for separate spacer bonding processes. This reduces the number of manufacturing steps and improves production yield
3Ease of manufacture
If spacers are used to form injection spaces, then molding can be performed, but misalignment and poor adhesion reduce yield
Solution Approach 1:
The patent removes spacers from the structure, allowing the molding compound to directly form the injection space and provide structural support. This eliminates the alignment issues between spacers and substrates that reduce manufacturing yield
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency, simplifies the manufacturing process, and increases the number of mountable semiconductor devices per unit area, while preventing spacer-related cracks and improving assembly precision.
Implementation Method 1
a first heat dissipation substrate, the first heat dissipation substrate being placed on the top of the first semiconductor device, wherein the first heat dissipation substrate is coupled to a second surface of the first semiconductor device
Implementation Method 2
using bumps to electrically connect semiconductor devices to a circuit board
Implementation Method 3
conductive clips to connect devices to heat dissipation substrates
Data Source
AI summary
A semiconductor module according to the present disclosure includes a circuit board having a first surface and a second surface, a first semiconductor device mounted on the first surface of the circuit board, a second semiconductor device mounted on the second surface of the circuit board, a first heat dissipation substrate placed on the top of the first semiconductor device, and a second heat dissipation substrate placed on the top of the second semiconductor device. The first heat dissipation substrate is coupled to a second surface of the first semiconductor device and the second heat dissipation substrate is coupled to a second surface of the second semiconductor device.