Bump-Electrode Tiled Display Interconnect for Reduced Boundary Visibility
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Solution Overview
Problem
Large-sized display devices experience increased defect rates and reduced productivity and reliability due to the higher number of light emitting elements in pixels, and tiled display devices suffer from a sense of separation between connected display units due to visible boundaries.
Innovation Solution
A display device is designed with a flexible film electrically connected to a pad part and a bump connection electrode without using a thermocompression process, and a tiled display device is implemented to minimize the recognition of boundaries between connected display units by reducing the non-display area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a large-sized display device is manufactured, then the screen size is increased, but the defect rate increases and productivity decreases due to the higher number of light emitting elements in pixels
Solution Approach 1:
The display device is divided into multiple small display modules that are connected to form a large-sized display. Each module contains a manageable number of light emitting elements, reducing the defect rate while achieving the desired large screen size through modular assembly
2Area of stationary object
If multiple display devices are connected to form a tiled display, then the screen size is increased, but the sense of separation increases due to visible boundaries and non-display areas
Solution Approach 1:
Multiple display modules are electrically and physically connected with minimal spacing, merging them into a unified display surface. The connections are designed to minimize visible boundaries and non-display areas, creating a seamless visual experience that maintains immersion
3Reliability
If a thermocompression process is used to connect the flexible film and pad part, then the electrical connection is achieved, but damage to the display area occurs
Solution Approach 1:
The thermocompression process is replaced with a cold connection method using conductive adhesive or solder paste that can be applied at lower temperatures. This substitution eliminates the thermal damage to the display area while maintaining reliable electrical connection between the flexible film and pad part
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces damage to the display area, improves visibility, and enhances the immersion experience by eliminating the recognition of boundaries between display units in tiled configurations.
Implementation Method 1
The bump electrode may be a solder ball including at least one of tin (Sn), silver (Ag), copper (Cu), gold (Au), and nickel (Ni)
Data Source
AI summary
A display device includes a first substrate including a first contact hole, a pad part on an upper surface of the first substrate and defining a second contact hole corresponding to the first contact hole, a bump connection electrode on the first substrate and extended into the second contact hole, a display layer on the pad part and the bump connection electrode, a flexible film on a lower surface of the first substrate and including a lead electrode adjacent to the first contact hole, and a bump electrode electrically connecting the lead electrode and the bump connection electrode to each other.