Bump Integrated Thermoelectric Cooler for Stacked IC Heat Management
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Solution Overview
Problem
High-performance integrated circuits face heat management challenges due to increased power density and thermal resistance in stacked packages, leading to localized hot spots that limit device performance and require throttling to prevent overheating.
Innovation Solution
Integration of thermoelectric cooling devices (TECs) within the interconnect layers between stacked IC devices or between IC devices and substrates to actively draw heat away from hot spots, enhancing vertical heat transfer and reducing temperature gradients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If power density is increased to improve device performance, then processing capability is improved, but heat generation increases leading to hot spots and temperature limits
Solution Approach 1:
The patent segments the heat removal function by placing individual thermoelectric cooler elements at multiple locations within the package, including between stacked IC devices and between IC devices and substrates. This distributed cooling approach targets localized hot spots directly, enabling high power density operation without excessive temperature rise.
Solution Approach 2:
The patent introduces thermoelectric cooler elements as intermediary components between heat-generating IC devices and heat sinks. These TEC elements act as active thermal mediators that convert electrical energy into directed heat flow, pumping heat away from hot spots through the interconnect layers and substrates.
2Productivity
If multiple IC devices are vertically integrated to improve performance, then device capability is improved, but thermal resistance increases impeding heat transfer
Solution Approach 1:
The patent places thermoelectric cooler elements within the interconnect layers between stacked IC devices, creating active thermal pathways through the vertical stack. These TEC elements overcome the inherent thermal resistance of the interconnect structures by actively pumping heat vertically through the package, maintaining reliable heat transfer despite increased device stacking.
Solution Approach 2:
The patent transitions from relying solely on passive vertical heat conduction through the stack to active heat pumping in the vertical dimension. By integrating TEC elements within interconnect layers, the system creates controlled thermal pathways that actively manage heat flow in the vertical direction, overcoming the thermal resistance barriers created by stacked devices.
3Temperature
If power delivery is limited to prevent overheating, then temperature control is maintained, but device performance is throttled
Solution Approach 1:
The patent introduces thermoelectric cooler elements as active thermal mediators that enable higher power delivery by actively managing heat removal. These TEC elements create an additional heat transfer pathway that prevents temperature runaway, allowing the system to operate at higher power levels without exceeding temperature limits and without requiring performance throttling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The TECs enable more effective heat dissipation from hot spots, allowing for increased power delivery without exceeding temperature limits, thereby improving IC device performance and reducing the need for throttling.
Implementation Method 1
thermoelectric cooling devices (TECs) within the interconnect layers between stacked IC devices or between IC devices and substrates to actively draw heat away from hot spots
Data Source
AI summary
An IC package, comprising a first IC component comprising a first interconnect on a first surface thereof; a second IC component comprising a second interconnect on a second surface thereof. The second component is above the first component, and the second surface is opposite the first surface. A thermoelectric cooling (TEC) device is between the first surface and the second surface. The TEC device is electrically coupled to the first interconnect and to the second interconnect.