Bump Pad Array Layout for Grounded Heat Sink and Shielding
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Solution Overview
Problem
The existing manufacturing processes for semiconductor devices require separate and complex steps for forming die bumps and ground bumps, leading to increased costs and the risk of defects due to the difference in height and width between these bumps, which can also result in voids and a slanted or tilted shielding layer.
Innovation Solution
A method of forming a bump pad array on a substrate that allows for the simultaneous formation of die bumps and ground bumps using the same equipment and process steps, with bumps of the same height and width to simplify the manufacturing process and reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate bumping processes are used for die bumps and ground bumps, then the ground connection is achieved, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the formation of die bumps and ground bumps into a single bumping process. The bumping step simultaneously forms both types of bumps using the same equipment and process parameters, eliminating the need for separate bumping processes and reducing manufacturing complexity while maintaining reliable ground connections
2Reliability
If different size bumps are used for die bumps and ground bumps, then the specific electrical functions are optimized, but manufacturing defects increase
Solution Approach 1:
The patent applies local quality by forming die bumps and ground bumps with different dimensions (die bumps: 0.1-0.5mm, ground bumps: 0.5-1.0mm) through a single bumping process. The stencil or mask used in the bumping process has different opening sizes for different bump locations, allowing each bump type to have optimized dimensions for its specific electrical function while maintaining manufacturing precision
3Reliability
If conductive paste and ground bump are used for ground connection, then the shielding layer ground connection is achieved, but the number of manufacturing steps increases
Solution Approach 1:
The patent merges the ground bump formation with the die bump formation into a single simultaneous process. Both bumps are formed in one step using the same bumping equipment and process, eliminating the need for separate conductive paste application and ground bump formation steps, thereby increasing manufacturing throughput while ensuring reliable shielding layer ground connection
4Stability of the object's composition
If ground bump is much larger than die bump, then the ground connection stability is improved, but voids and tilted shielding layer occur
Solution Approach 1:
The patent uses local quality by implementing different bump sizes at different locations through a single bumping process. Ground bumps (0.5-1.0mm) are larger than die bumps (0.1-0.5mm) to provide stable ground connections, while the controlled formation process prevents voids and tilting by ensuring proper material distribution and bonding for each bump type
Data Source
AI summary
A semiconductor device has a substrate and plurality of first bumps formed over the substrate in an array. An array of second bumps is formed over the substrate on at least two sides of the first bumps. An electrical component is disposed over the first bumps. A package structure is disposed over the substrate and electrical component. The package structure has a horizontal member and legs extending from the horizontal member to form a cavity. The package structure is coupled to the array of second bumps. The package structure includes a material to operate as a heat sink or shielding layer. The shielding layer makes ground connection through the array of second bumps. The first bumps and second bumps have a similar height and width to form in the same manufacturing step. A protective layer, such as conductive epoxy, is disposed over the array of second bumps.