Semiconductor Bump Pad Layout to Prevent Shorts and Wetting Defects

Solution Overview

Problem

In the semiconductor industry, high-bandwidth memory (HBM) requires efficient arrangement of conductive bumps to prevent defects such as electric shorts and wetting defects due to increasing density and performance, which existing methods fail to address effectively.

Innovation Solution

A semiconductor chip and package design where signal and power bump pads are strategically positioned, with signal bump pads in the central region and power bump pads disposed along the edges, ensuring a minimum distance of 900 μm from the edges to prevent defects caused by tilting and warpage, and through vias electrically connecting these pads to prevent short circuits and wetting issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the size of bumps is decreased to increase density, then the number of bumps can be increased to provide higher bandwidth, but the risk of electric shorts and wetting defects between conductive bumps increases

Engineering Contradiction:

ImprovebandwidthVSAvoiddefect prevention

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent applies local quality by creating different pad structures in different regions of the chip. Power bump pads are designed with larger sizes and different configurations compared to signal bump pads, allowing each region to be optimized for its specific function while maintaining overall reliability despite high density

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent segments the bump pad arrangement into distinct functional groups: signal bump pads arranged in a central region and power bump pads arranged in peripheral regions. This segmentation allows independent optimization of each group's arrangement to prevent specific defect types while maintaining high overall density

Inventive Principle:

Principle #1Segmentation

2Device complexity

If bump pads are arranged closer to edges to maximize space utilization, then device complexity is reduced, but electric shorts and wetting defects occur more frequently due to tilting and warpage

Engineering Contradiction:

Improvearrangement simplicityVSAvoiddefect prevention

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The patent applies local quality by creating different pad structures in different regions of the chip. Power bump pads are designed with larger sizes and different configurations compared to signal bump pads, allowing each region to be optimized for its specific function while maintaining overall reliability despite high density

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent segments the bump pad arrangement into distinct functional groups: signal bump pads arranged in a central region and power bump pads arranged in peripheral regions. This segmentation allows independent optimization of each group's arrangement to prevent specific defect types while maintaining high overall density

Inventive Principle:

Principle #1Segmentation

3Quantity of substance

If the number of bumps is increased to achieve higher density, then bandwidth is improved, but the difficulty of detecting and measuring arrangement defects increases

Engineering Contradiction:

Improvenumber of bumpsVSAvoiddefect detection

Core Design Contradiction:

Quantity of substanceVSDifficulty of detecting and measuring

Solution Approach 1:

The patent applies local quality by creating different pad structures in different regions of the chip. Power bump pads are designed with larger sizes and different configurations compared to signal bump pads, allowing each region to be optimized for its specific function while maintaining overall reliability despite high density

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent segments the bump pad arrangement into distinct functional groups: signal bump pads arranged in a central region and power bump pads arranged in peripheral regions. This segmentation allows independent optimization of each group's arrangement to prevent specific defect types while maintaining high overall density

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20250105182A1Semiconductor chip and semiconductor package including the same

Publication Date: 2025.03.27 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor chip may include a body, and first bump pads disposed on a front surface of the body, including signal bump pads and power bump pads. The signal bump pads may be disposed in a central region of the body in a first direction along a second direction crossing the first direction. The power bump pads may include first power bump pads disposed along the first direction in a central region of the body in the second direction, and the second power bump pads may be disposed along the second direction on both sides of the first power bump pads in the first direction.