Protective Tape Application for Bump Wafers Without Residual Stress
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Solution Overview
Problem
The existing methods for applying protective tapes to bump wafers often result in damage to the wafer irregularities due to residual stress and improper adhesion, leading to warping or breaking during thickness reduction processes.
Innovation Solution
An application apparatus and method that uses a pressing member with a protective layer outer periphery retainer to apply the protective tape to the wafer, ensuring close contact without creases or residual stress, utilizing a vacuum chamber and elastic members to support the retainer for precise application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the protective tape is pressed with an application roller to be applied to the bump wafer by the same method as that of the related art, then the protective tape can be applied to the wafer, but the irregularities of the bump wafer are liable to be broken and residual stress is generated on the protective tape
Solution Approach 1:
A release tape is introduced as an intermediary carrier to temporarily hold the protective tape in a relaxed state before application. The release tape allows the protective tape to be transferred to the wafer without being directly pulled by the application roller, thus preventing residual stress generation and irregularity damage while maintaining application capability
2Productivity
If the protective tape is pulled by the application roller during application, then the protective tape can be applied to the wafer, but residual stress is generated on the protective tape causing wafer warping or breaking
Solution Approach 1:
The release tape serves as a mediator that absorbs the pulling force during application. The protective tape is peeled from the release tape and applied to the wafer in a controlled manner without direct roller pulling, eliminating residual stress while maintaining efficient application through the peeling mechanism
3Device complexity
If the protective tape is applied without proper support, then the application process is simple, but the protective tape cannot be properly applied to the bump wafer and irregularities are damaged
Solution Approach 1:
A pressing member with a pressing portion is introduced to provide localized pressure support during application. The pressing portion corresponds to the wafer's circuit forming portion and applies pressure only where needed, ensuring proper adhesion of the protective tape to the bump wafer's irregularities without requiring complex overall apparatus changes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for proper adhesion of the protective tape to the wafer without damaging the irregularities, preventing warping or breaking during thickness reduction and enhancing application efficiency.
Implementation Method 1
utilizing a vacuum chamber and elastic members to support the retainer for precise application
Implementation Method 2
utilizing a vacuum chamber and elastic members to support the retainer for precise application
Data Source
AI summary
To satisfactorily apply a protective tape to a bump wafer, an application apparatus (1) for applying a protective tape (PT) to a wafer (W) includes: an application table (60) configured to support the wafer (W); a tape holding body (30) capable of holding the protective tape (PT) and configured to supply the protective tape (PT) held by the tape holding body (30) onto the wafer (W); and a pressing member (62) configured to press the protective tape (PT) from above. The pressing member (62) includes a protective layer outer periphery retainer (620) configured to press a peripheral portion of a protective layer (PL), which is laminated on the protective tape (PT) and has an outer diameter smaller than an outer diameter of the wafer (W), to apply the protective tape (PT) to the wafer (W).